Tag: Intel

Esta es probablemente la mini PC más extraña de 2024: la última rareza de Minisforum tiene dos puertos Ethernet de 5 Gbps, un Oculink, una cámara web y una pantalla de 4 pulgadas, además de la CPU para computadora portátil más potente de Intel.

Post author By lisa nichols
Post date May 16, 2024
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el Las mejores mini computadoras Son conocidos por su diseño compacto y portabilidad, pero tienen la reputación de sacrificar a veces potencia y funciones por el tamaño, algo que Minisforum está disipando constantemente con su gama de productos.

El último lanzamiento de la compañía china es Corporación Intel Mini PC Ultra 9 AI con pantalla táctil LED de 480p de 4 pulgadas que muestra el reloj, información del sistema y más. Nosotros primero Este sistema ha sido reportado En enero de 2024, pero desde entonces obtuvo un nuevo nombre, AtomMan X7 Ti, y una mejora en las especificaciones.

El X7 Ti funciona con un procesador Intel Ultra 9 185H Meteor Lake con 16 núcleos y 22 subprocesos, que ofrece hasta 5,1 GHz (con un TDP predeterminado de 45 W). Viene con gráficos Intel Arc integrados con 8 núcleos de GPU Xe y una NPU AI acelerada por hardware. La mini PC puede alimentar hasta cuatro pantallas a través de puertos HDMI 2.1, DP 2.0 y 2x USB4.

Comunicarse más rápido

Como el Minisforum de aspecto similar Estación de trabajo compacta UM790 XTXEl AtomMan X7 Ti viene con un puerto OCulink para que puedas conectar tarjetas GPU profesionales al dispositivo.

Hay dos ranuras SODIMM que admiten hasta 96 GB de RAM DDR5 5600, dos ranuras M.2 PCIe4.0 con hasta 4 TB de almacenamiento y una ranura para tarjeta de expansión SD.

Viene con una cámara web incorporada compatible con Windows Hello de 1080p y micrófonos digitales duales para videollamadas.

El X7 Ti tiene dos puertos Ethernet de 5 Gbps (cuando se anunció a principios de año, eran puertos más lentos de 2,5 Gbps), que brindan conectividad por cable confiable y de alta velocidad y Wi-Fi 7 a una velocidad máxima teórica de hasta 5,8 Gbps y 320 MHz. Canal de Banda ancha.

Usted será capaz de Reserva el X7 Ti A partir del 20 de mayo, pero aún no hay información sobre precios.

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Las nuevas CPU de Intel pueden parecer débiles, pero podrían ser una gran noticia para los Chromebook más asequibles

Post author By lisa nichols
Post date May 16, 2024
No Comments on Las nuevas CPU de Intel pueden parecer débiles, pero podrían ser una gran noticia para los Chromebook más asequibles

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Se ha revelado más información sobre Corporación IntelLos procesadores patentados de Twin Lake tienen que ver con la eficiencia y el bajo uso de energía para dispositivos económicos.

De hecho, estas son CPU que solo tienen núcleos de eficiencia, sin núcleos de rendimiento (los que encontrará en los chips de escritorio de Intel), y se ha revelado que el sucesor del Intel N100 es el N250.

Esta CPU Twin Lake cuenta con cuatro núcleos con frecuencia de 1,2 GHz según una filtración de datos extraída de @InstLatX64 en X (anteriormente Twitter). Se espera que sea una pequeña actualización con respecto al modelo anterior Alder Lake-N (N100), pero no hay información sobre el reloj de impulso en este momento.

#TwinLake (CPUID B06E0, 4c/4th, 1,2 GHz, sin HTT) se encuentra entre los probadores de #Intel: https://t.co/v6qc33SzVDB La serie de marca es “Intel(R) N250” https://t.co /N0Km0vgdgt pic.twitter.com/qqHTcXMAFy14 de mayo de 2024

Como lo vi dispositivos de toms, Parece que el Intel N250 se basará en la arquitectura Alder Lake-S, lo que significa que tiene núcleos de eficiencia Gracemont, lo que esencialmente significa que el chip funcionará de manera similar a un Core i3. La CPU está lejos de ser una de Los mejores procesadores En el mercado, pero el precio puede ser su salvación.

Esto se debe a que el Intel N100 se vende por $55 y esperamos que el Intel N250 tenga el mismo precio que el chipset móvil posterior. Esto significa que los Chromebooks de gama baja y otras computadoras portátiles con CPU no deberían ver un aumento de precio a pesar de un rendimiento superior, lo que podría marcar una gran diferencia.

Como referencia, podemos centrar nuestra atención en Las mejores Chromebook Al final de la escala del presupuesto y lo que ofrecen. Aquellos que tienen poco dinero y desean una potencia informática liviana pueden considerar productos como Lenovo IdeaPad Flex 3 Chromebook Por $349. Sin embargo, lo interesante es una CPU Intel Celeron N4020 de 1,1 GHz.

Este procesador es bastante básico, con su diseño de doble núcleo, uso de energía de solo 6 W y un reloj de impulso de 2,8 GHz. Es un chip más antiguo en términos informáticos que se lanzó en 2019, aunque se ha utilizado en Chromebooks recientes. Por el contrario, el N250 filtrado tiene un rendimiento potencialmente deficiente.

Chromebook Asus

(Crédito de la imagen: futuro)

Los procesadores Twin Lake pueden acelerar los Chromebook baratos

Aunque los Chromebook están lejos de ser líderes en términos de rendimiento de portátiles, ofrecen precios bajos y aplicaciones livianas, ya que en su mayoría están basados en la web. Sin embargo, se notará duplicar la potencia del procesador y mejorará el rendimiento general con la navegación web, el procesamiento de textos, la reproducción multimedia, el cifrado y más.

El N250 recuerda a lo que estamos acostumbrados a ver en los procesadores de cuatro núcleos de Intel en la época anterior a los chips Core i5, i7 e i9. Twin Lake parece ser una mejora convincente con respecto al Celeron que continúa resistiendo después de todos estos años, y aunque parece redundante en el chip N100, el N250 entrante debería proporcionar un impulso.

The socket is the motherboard, Part 2 — Intel archrival (and Nvidia’s BFF) plans to build giant chips that could use kilowatts of power but they won’t be as big as Cerebras trillion transistor behemoth

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A few weeks ago, we wrote how Eliyan’s NuLink PHY could do away with silicon interposers and integrate everything into an single, elegant package. How, essentially, the socket could become the motherboard.

At the recent 30th annual North America Technology Symposium, the Taiwan Semiconductor Manufacturing Company (TSMC) revealed plans to construct a version of its chip-on-wafer-on-substrate (CoWoS) packaging technology that could lead to system-in-packages (SiPs) over twice the size of the current largest ones.

“With System-on-Wafer, TSMC is providing a revolutionary new option to enable a large array of dies on a 300mm wafer, offering more compute power while occupying far less data center space and boosting performance per watt by orders of magnitude,” the company said.

An enormous amount of power

TSMC’s first SoW offering, a logic-only wafer based on Integrated Fan-Out (InFO) technology, is already in production.

A chip-on-wafer version using CoWoS technology is expected to arrive in 2027, and will enable the “integration of SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to a data center server rack, or even an entire server.“

Reporting on the move, Tom’s Hardware expands on this saying, “One of the designs that TSMC envisions relies on four stacked SoICs mated with 12 HBM4 memory stacks and additional I/O dies. Such a giant will certainly draw an enormous amount of power – we are talking about thousands of watts here and will need a very sophisticated cooling technology. TSMC also expects such solutions to use a 120x120mm substrate.”

TSMC’s ambitious pursuit to create gigantic chips, however, is dwarfed by Cerebras Systems’ newest Wafer Scale Engine 3 (WSE-3), termed the “fastest AI chip in the world”. The WSE-3 boasts four trillion transistors and is twice as powerful as its predecessor, the WSE-2, while maintaining the same energy consumption and price. This new chip created on a 5nm TSMC process, provides a staggering peak AI performance of 125 petaflops – which is equivalent to 62 Nvidia H100 GPUs.

New Intel Arrow Lake leak alleges no Thunderbolt 5 support for Z890 motherboards

Post author By lisa nichols
Post date May 7, 2024
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A prominent hardware leaker has alleged that while Thunderbolt 4 will come as standard for Intel Core Ultra 200 CPUs on Z890, that the upcoming CPU generation will miss out on Thunderbolt 5.

As spotted by Videocardz, hardware leaker Golden Pig Upgrade has claimed that Intel Arrow Lake will miss out on Thunderbolt 5 support for Z890 motherboards after all, despite its unveiling last year. If true, it’s disappointing news considering that Intel 14th Gen missed out on Thunderbolt 5 at release, too.

As a frame of reference, both Thunderbolt 3 and Thunderbolt 4 are capped at 40 Gbps which means there’s no great increase in the two technologies despite their seven-year age gap. In contrast, Thunderbolt 5 can achieve double this at 80 Gbps which can be increased to 120 Gbps through Bandwidth Boost.

Also alleged by Golden Pig Upgrade is that Ultra Core 200 CPUs will feature just four Xe cores baked onto the chip which is half of what’s currently available through Meteor Lake for laptops. This is unlikely to be too big a deal considering most (if not all) users will pair the processor with one of the best graphics cards, but it’s worth noting.

We can take the alleged specs for the Arrow Lake flagship as a point of comparison. It’s believed that the Intel Core Ultra 9 285K will feature 24 cores and 24 threads with a maximum boost clock of up to 5.5 GHz and a 125W TDP. In contrast, the current-generation Intel Core i9-14900K features 24 cores and 32 threads up to 6 GHz. It’s certainly a different approach moving to Disaggregated architecture from Hybrid.

Not the best impression for Arrow Lake

Should Intel Arrow Lake miss out on Thunderbolt 5, that would mean that we would likely have to wait until Lunar Lake in laptops and Panther Lake in desktops to get ahead.

The new connectivity standard would mean not only increased bandwidth for external GPUs and SSDs but also boosting higher resolutions and framerates of up to 540Hz and enhanced multi-monitor in 4K and 8K (via Intel).

Leaked plans reveal Intel could release 21 Arrow Lake-S CPUs this year

Post author By lisa nichols
Post date May 7, 2024
No Comments on Leaked plans reveal Intel could release 21 Arrow Lake-S CPUs this year

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Intel Arrow Lake appears to be on the horizon according to new insider information which claims a total of 21 CPUs will be available in the upcoming lineup.

As spotted by Wccftech, Intel Arrow Lake-S Core Ultra-200 processors are rumored to be announced at Computex next month with a full suite of processors headed for store shelves this year. According to Benchlife, this is set to include the Core Ultra 9 285K, Core Ultra 7 265K, and the Core Ultra 5 245K.

Interestingly, it’s believed that there will be no Core Ultra 3 or Core i3 equivalent included in the slew of Ultra 200 processors so the mainstream lineups are now considered to be Ultra 5 models. That’s not entirely a surprise given that even the best processors for gamers on a budget omit the underpowered i3.

It is believed that as well as the three aforementioned K models at 12W5, there will be a total of five non-K SKUs at 65W and a total of 13 processors set to release later which will run at just 35W. That’s a wide net and should give options to the vast majority of users; while gamers will want a K model, budget builds could benefit from a lower power, and cheaper chip.

Hyperthreading appears to be a thing of the past with the leading Intel Arrow Lake-S models. That’s because the Core Ultra 9 is speculated to run 24 cores and 24 threads with the Core Ultra 7 to feature 20 cores and 20 threads, and the Core Ultra 5 at 10 cores and 10 threads; all of which utilize a mixture of E-cores and P-cores.

All chipsets will run on the LGA 1851 socket with its longevity planned until 2026 which, much like AMD‘s AM5 socket, will just be using DDR5. That means it could be time to upgrade to some of the best RAM alongside a new motherboard so that you aren’t left behind.

It’s still a little confusing

We’ve previously reported on the Intel Arrow Lake-S naming conventions being confusing and the advent of so many Ultra 9, Ultra 7, and Ultra 5 models isn’t helping matters. While enthusiasts are going to want to stick to the 285K, 265K, and 245K, there are a lot of things to unlearn after nearly 16 years of being used to Intel Core branding.

It remains to be seen exactly how disaggregated architecture will work when on desktops, especially with the transition over to AI computing and what that will mean for gamers. We’re hoping that Computex will clear things up with an official announcement going over the full flagship models and the other 65W variants.

Intel Core Ultra 200 Arrow Lake CPUs could be coming earlier than expected

Post author By lisa nichols
Post date May 6, 2024
No Comments on Intel Core Ultra 200 Arrow Lake CPUs could be coming earlier than expected

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An MSI overclocker has alleged that the upcoming Intel Arrow Lake processor could be coming as early as Q3 2024 which would be significantly ahead of what we’ve previously thought.

As reported by KitGuru, an MSI overclocker named Toppc has dropped hints about the MSI Dragon Event in Wuhan, China which is rumored to feature information on the “next” platform which is heavily speculated to be the socket LGA 1851 desktop processors – Arrow Lake-S (via Chiphell).

Previously, it’s been rumored that we would not see Intel Arrow Lake until 2025 so the news that the chipset generation could be coming in just a few months is certainly welcome news. This source also corroborates that the Core Ultra 9, Core Ultra 7, and Core Ultra 5 models will be exclusive to DDR5 RAM, as with AMD‘s AM5 socket.

In terms of what we can expect from the Intel Core Ultra 200 lineup, the flagship of the next-gen CPU generation is believed to be the Ultra 9 285K. According to Wccftech, it’s alleged that this top-end chipset will top out at 5.5 GHz which is down significantly from the 6 GHz of the Intel Core i9-14900K and the 6.2 GHz of the 14900KS.

For reference, that’s the same out-of-the-box speed as the Alder Lake flagship model, the 12900KS, which debuted over three years ago. With changes in architecture, going from socket 1700 (Hybrid) over to socket 1851 (Disaggregated), it seems as though Intel is prioritizing efficiency over raw power with its upcoming CPU generation.

A Q3 release date is possible, but unlikely

Q3 2024 is between July and September which means Intel Arrow Lake could debut anywhere from two to three months from now. Considering the rumors circulating pointing at an end-of-year or early 2025 release date, we’re leaning more towards a later rather than sooner release date, but the K variants could come first.

Toppc has been on the money with leaks and rumors in the past, most notably with the pre-release information surrounding socket AM5 AMD CPUs in 2022 (via Chiphell). That lends credence to the fact we may not be waiting as long, as MSI’s internal events could suggest an earlier release, but we aren’t convinced of a summer release date at this time.

It’s fair to say that things have been turbulent for Arrow Lake. Recently, the pre-release silicon has been available for sale illegally in China. Engineering samples are being sold for as little as $14, however, even if the hardware is in the fabrication process that doesn’t necessarily mean it will be ready for prime time within the next three months. We’ll be keeping you updated on all things Arrow Lake as they happen.

A US supercomputer with 8,000 Intel Xeon CPUs and 300TB of RAM is being auctioned — 160th most powerful computer in the world has some maintenance issues though and will cost thousands per day to run

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The Cheyenne supercomputer, based at the NCAR-Wyoming Supercomputing Center (NWSC) in Cheyenne, Wyoming, was ranked as the 20th most powerful computer in the world in 2016 – but now it’s up for sale through the US General Services Administration (GSA).

By November 2023, the 5.34-petaflops system’s ranking had slipped to 160th in the world, but it’s still a monster, able to carry out 5.34 quadrillion calculations per second. It has been put to a number of noteworthy purposes in the past, including studying weather phenomena and predicting natural disasters.

The Cheyenne Supercomputer is a monster installation made up of SGI ICE XA modules which comprises of 14 E-Cells, weighing 1,500 lbs each, and 28 water-cooled E-Racks. There are 8,064 Intel “Broadwell” Xeon processors (18-core 2.3GHz E5-2697v4) with a total count of 145,152 cores. In terms of memory, it has 313,344GB of DDR4-2400 ECC single-rank memory and 224 IB Switches. The supercomputer also comes with two air-cooled management racks, each featuring 26 1U servers.

“Repairable”

Howeer, potential buyers do need to be aware of a few issues. Firstly, the unit doesn’t come with fiber optic and CAT5/6 cabling, although the internal DAC cables within each cell are provided and will be “meticulously labeled and packaged in boxes”, and it comes with previously used PGW coolant fluid (around10 gallons per E-cell). It will need to be collected by a professional moving company and the purchaser “assumes responsibility for transferring the racks from the facility onto trucks using their equipment.”

A major red flag is that the supercomputer is worryingly listed as “repairable”. The auction page states “the system is currently experiencing maintenance limitations due to faulty quick disconnects causing water spray. Given the expense and downtime associated with rectifying this issue in the last six months of operation, it’s deemed more detrimental than the anticipated failure rate of compute nodes.

Approximately 1% of nodes experienced failure during this period, primarily attributed to DIMMs with ECC errors, which will remain unrepaired. Additionally, the system will undergo coolant drainage.”

With a couple of days to go before the auction ends, bidding currently stands at $50,085 with the reserve not yet met. Should you wish to buy a piece of supercomputer history, and have the deep pockets required to get it up and running, and the space to house it, you can put in a bid here.

6-screen laptop manufacturer is very much alive — Acme Portable’s Megapac L3 is the original hexadisplay mobile powerstation and is still on sale, shame that it is still using old dual CPU tech from AMD and Intel

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It was hard not to shed a tear when MediaWorkstation disappeared, taking its wild six-screen a-X2P workstation laptop with it.

The company’s workstation laptop promised to be an incredible, and ridiculous, powerhouse, with two AMD EPYC Genoa Zen 4 CPUs, two full-size GPUs, up to 3TB DDR5 RAM, one M.2 NVMe boost SSD, and five storage drives.

But if you still have a yearning to own a laptop with half a dozen screens attached to it, then we have good news.

Choice of screen resolutions

Acme Portable’s Megapac L3, the successor to the company’s FlexPAC III, is available to buy and while it only – only! – comes with three 24-inch displays, it can be combined with the company’s ML3 triple display accessory, for a grand total of six screens.

If you’re noticing similarities between this system and the discontinued a-X2P beast, it’s because MediaWorkstation was once a reseller for Acme Portable and had been looking to push the limits of what could be achieved with the platform.

The Megapac L3’s 3x 23.8-inch displays come in a choice of resolutions – UHD (3840×2160) with up to 800 nits brightness, Full HD (1920×1080) with up to 1000 nits, or WUXGA (1920×1200) with 1000 nits, all featuring an optional touchscreen.

It’s powered by a single/dual Intel Xeon, Intel Core, AMD Ryzen or AMD EPYC CPU, with up to 1TB DDR4 RAM and up to 150TB storage. There are seven expansion slots, and it comes with an 850W auto-switching power supply, although there are 1000W or 1200W PSU’s available.

The dimensions for the three screen Megapac L3 are 16.39-inches high, 22.96-inches wide and 11.98-inches deep, with a weight of 52.82 lbs. It comes with a 105-key keyboard with an integrated touchpad, padded rolling transit case, and can be customized to military specifications.

There’s no pricing available on the website, but if you want the Megapac L3, with three or six screens, you can contact them with your requirements.

Samsung’s archrival strikes crucial partnership with Nvidia’s closest ally to deliver key next-gen memory — SK Hynix teams up with TSMC to advance HBM development but could this move encourage TSMC to become like Intel?

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South Korean memory giant SK Hynix, which recently announced plans for the construction of the world’s largest chip factory, has now announced a major partnership with top Taiwanese semiconductor foundry, TSMC.

The two firms aim to cement their positions in the fast-growing AI market by developing and producing the next-generation of High Bandwidth Memory, known as HBM4.

The production, scheduled for 2026, will make use of TSMC’s state-of-the-art packaging technology. The project’s initial focus will be on the improvement of the performance of the base die, the element of HBM that connects directly to the GPU. SK Hynix will reportedly adopt TSMC’s advanced logic process for HBM4’s base die, allowing for extra functionality to be packed into a minimal space. The two firms intend to optimize the integration SK Hynix’s HBM and TSMC’s CoWoS (Chip on Wafer on Substrate) technology.

A strategic move for TSMC

“We expect a strong partnership with TSMC to help accelerate our efforts for open collaboration with our customers and develop the industry’s best-performing HBM4,” said Justin Kim, President and the Head of AI Infra, at SK Hynix. “With this cooperation in place, we will strengthen our market leadership as the total AI memory provider further by beefing up competitiveness in the space of the custom memory platform.”

Dr. Kevin Zhang, Senior Vice President of TSMC’s Business Development and Overseas Operations Office, and Deputy Co-Chief Operating Officer, agreed, stating, “TSMC and SK Hynix have already established a strong partnership over the years. We’ve worked together in integrating the most advanced logic and state-of-the art HBM in providing the world’s leading AI solutions. Looking ahead to the next-generation HBM4, we’re confident that we will continue to work closely in delivering the best-integrated solutions to unlock new AI innovations for our common customers.”

This collaboration is a strategic move for TSMC as much as it is for SK Hynix – if not more so – and demonstrates the firm’s potential in a role beyond foundry service provider. It’s hard to guess at the future, but should TSMC wish to continue its growth trajectory, it may need to consider expanding its strategic horizons even further, a move which could see it competing with some of its partners such as AMD or even rivals like Intel.

Competition is fierce in the semiconductor industry and moving up the value chain – leveraging its advanced technology to drive higher margins – is a risky move, but one that could potentially be hugely rewarding for the Taiwanese chip giant.

Via Nikkei

‘Inspired by the human brain’: Intel debuts neuromorphic system that aims to mimic grey matter with a clear aim — making the machine exponentially faster and much more power efficient, just like us

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Neuromorphic computing is about mimicking the human brain’s structure to deliver more efficient data processing, including faster speeds and higher accuracy, and it’s a hot topic right now. A lot of universities and tech firms are working on it, including scientists at Intel who have built the world’s largest “brain-based” computing system for Sandia National Laboratories in New Mexico.

Intel’s creation, called Hala Point, is only the size of a microwave, but boasts 1.15 billion artificial neurons. That’s a massive step up from the 50 million neuron capacity of its predecessor, Pohoiki Springs, which debuted four years ago. There’s a theme with Intel’s naming in case you were wondering – they’re locations in Hawaii.

Hala Point is ten times faster than its predecessor, 15 times denser, and with one million circuits on a single chip. Pohoiki Springs only had 128,000.

Making full use of it

Equipped with 1,152 Loihi 2 research processors (Loihi is a volcano in Hawaii), the Hala Point system will be tasked with harnessing the power of vast neuromorphic computation. “Our colleagues at Sandia have consistently applied our Loihi hardware in ways we never imagined, and we look forward to their research with Hala Point leading to breakthroughs in the scale, speed and efficiency of many impactful computing problems,” said Mike Davies, director of the Neuromorphic Computing Lab at Intel Labs.

Since a Neuromorphic system of this scale hasn’t existed before, Sandia has been developing special algorithms to ultimately make use of the computer’s full capabilities.

“We believe this new level of experimentation – the start, we hope, of large-scale neuromorphic computing – will help create a brain-based system with unrivaled ability to process, respond to and learn from real-life data,” Sandia lead researcher Craig Vineyard said.

His colleague, fellow researcher Brad Aimone added, “One of the main differences between brain-like computing and regular computers we use today – in both our brains and in neuromorphic computing – is that the computation is spread over many neurons in parallel, rather than long processes in series that are an inescapable part of conventional computing. As a result, the more neurons we have in a neuromorphic system, the more complex a calculation we can perform. We see this in real brains. Even the smallest mammal brains have tens of millions of neurons; our brains have around 80 billion. We see it in today’s AI algorithms. Bigger is far better.”