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Realmente es una pena, pero la primera eGPU del mundo con interfaz Thunderbolt 5 no funciona en Apple Silicon

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  • Apple no admite eGPU, pero la interfaz más rápida abre un mundo de oportunidades
  • El nuevo contenedor Sparkle tiene asa incorporada y ofrece hasta 850 vatios
  • Se espera que desembarquen más contenedores TB5 en 2025

Sparkle eGPU Studio-G 850 presentada en CES 2025 (a través de TechPowerUp), lleva Thunderbolt 5 a la gama de dispositivos externos GPU Paquetes.

Esto aumenta la velocidad de transferencia de datos a 120 Gbps, una mejora significativa con respecto al estándar Thunderbolt 3 disponible anteriormente.

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Apple could revive a legendary product it killed 13 years ago — heir to Xserve to run on M2 Ultra silicon according to reports but no sign of Mac OS X Server yet

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Apple may be late to the generative AI party but just don’t count it out yet. According to Bloomberg’s Marc Gurman and MacRumors’ Hartley Charlton, the company will use the M2 Ultra in its own servers – in its own data centres – to power its growing GAI ambitions. Launched in June 2023, the CPU – as used in the Mac Studio – remains the most complex piece of silicon ever released by Apple with 24 compute cores, up to 76 GPU cores and 32 AI accelerators.

The report neither mentions whether Apple plans to revive its defunct Xserve range of rack servers nor if it will bring back its Mac OS X server operating system. Both products have been mothballed for years as Apple moved its focus away from the enterprise market at the beginning of the last decade. A separate article from WSJ also adds that Apple is using the internal code name ACDC (Apple Chips in the Data Center).

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Apple Reportedly Developing Its Own Custom Silicon for AI Servers

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Apple is said to be developing its own AI server processor using TSMC’s 3nm process, targeting mass production by the second half of 2025.

Apple Silicon AI Optimized Feature Siri 1
According to a post by the Weibo user known as “Phone Chip Expert,” Apple has ambitious plans to design its own artificial intelligence server processor. The user, who claims to have 25 years of experience in the integrated circuit industry, including work on Intel’s Pentium processors, suggests this processor will be manufactured using TSMC’s ‌3nm‌ node.

TSMC is a vital partner for Apple, manufacturing all of its custom silicon chips. The chipmaker’s ‌3nm‌ technology is one of the most advanced semiconductor processes available, offering significant improvements in performance and energy efficiency over the previous 5nm and 7nm nodes.

Apple’s purported move toward developing a specialist AI server processor is reflective of the company’s ongoing strategy to vertically integrate its supply chain. By designing its own server chips, Apple can tailor hardware specifically to its software needs, potentially leading to more powerful and efficient technologies.

Apple could use its own AI processors to enhance the performance of its data centers and future AI tools that rely on the cloud. While Apple is rumored to be prioritizing on-device processing for many of its upcoming AI tools, it is inevitable that some operations will have to occur in the cloud. By the time the custom processor could be integrated into operational servers in late 2025, Apple’s new AI strategy should be well underway.

The Weibo user has a number of accurate previous claims, including that the iPhone 7 would be water-resistant and that the standard iPhone 14 models would continue using the A15 Bionic chip, with the more advanced A16 chip being exclusive to the ‌iPhone 14‌ Pro models. These predictions were later corroborated by multiple credible sources and proved correct upon the products’ release.

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These PS5 SSD deals from Silicon Power are some of the best offerings we’ve seen in a while

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PS5 SSD deals have been hard to come by for a while now, but if you’re looking to pick one up right now then Silicon Power’s XS70 range has a bunch of tempting discounts right now over at Amazon.

The most impulse-purchase-worthy deal is the 1TB XS70 PS5 SSD which is down to $74.99 at Amazon (was $85.99). It’s a 13% price cut and takes the drive to its second lowest-ever price.

If you need a bit more storage and breathing room, the 2TB model has the biggest price cut of the three models and is down 22%, dropping its price to $139.99 at Amazon (was $179.99). As far as we can tell, this is nearly a lowest-ever price – perhaps missing that mark by only a couple of dollars. 

For those looking to solve their PS5 storage woes in one fell swoop and cover themselves for years to come, the 4TB XS70 has got a handy 10% discount running right now with the drive dropping to $269.99 at Amazon (was $299.99). This is the 4TB model’s lowest price since February and is decent value for a large-capacity drive.

Silicon Power might not be the most famous name in storage, but the brand offers excellent products, and usually at value-busting prices – something that’s accentuated today with these price cuts.

Today’s best PS5 SSD deals

The XS70 comes with a heatsink already so immediately wins points for offering a ready-to-go storage solution. Offering speeds of up to 7,200 MB/s (write) and 6,800 MB/s (read) means it’ll also offer you top-drawer performance, reducing the time you spend looking at loading screens and waiting times while you transfer files. It’s got more than enough chops to make it feel like you’re just using the PS5’s own storage.

In a field barren of price cuts on the best SSDs for PS5, or even any truly outstanding cheap PS5 SSD deals, these price cuts offer a good value way of bolstering your storage.

Not in the US, or looking for even more options? Then check out even more prices on PS5 SSD’s below no matter where you are in the world.

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AMD teams up with Arm to unveil AI chip family that does preprocessing, inference and postprocessing on one silicon — but you will have to wait more than 12 months to get actual products

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AMD is introducing two new adaptive SoCs – Versal AI Edge Series Gen 2 for AI-driven embedded systems, and Versal Prime Series Gen 2 for classic embedded systems.

Multi-chip solutions typically come with significant overheads but single hardware architecture isn’t fully optimized for all three AI phases – preprocessing, AI inference, and postprocessing. 

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TSMC’s Next-Generation Chip Technology for Apple Silicon on Schedule

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Apple chipmaker TSMC is making progress toward manufacturing 2nm and 1.4nm chips that are likely destined for future generations of Apple silicon, DigiTimes reports.

apple silicon feature joeblue
The manufacturing time frames for mass production of 2nm and 1.4nm chips have now apparently been determined: Trial production of the 2nm node will begin at in the second half of 2024, with small-scale production ramping up in the second quarter of 2025. Notably, TSMC’s new plant in Arizona will also join 2nm production efforts. In 2027, facilities in Taiwan will start to shift toward production of 1.4nm chips.

TSMC’s first 1.4nm node is officially called “A14” and will follow its “N2” 2nm chips. N2 is scheduled for mass production in late 2025, to be followed by an enhanced “N2P” node in late 2026.

Historically, Apple is among the first companies to adopt new, state-of-the-art chip fabrication technologies. For example, it was the first company to utilize TSMC’s 3nm node with the A17 Pro chip in the iPhone 15 Pro and ‌iPhone 15 Pro‌ Max, and Apple is likely to follow suit with the chipmaker’s upcoming nodes. Apple’s most advanced chip designs have historically appeared in the iPhone before making their way to the iPad and Mac lineups. With all of the latest information, here’s how the ‌iPhone‌’s chip technology is expected to look going forward:

  • ‌iPhone‌ XR and XS (2018): A12 Bionic (7nm, N7)
  • ‌iPhone‌ 11 lineup (2019): A13 Bionic (7nm, N7P)
  • ‌iPhone‌ 12 lineup (2020): A14 Bionic (5nm, N5)
  • iPhone 13 Pro (2021): A15 Bionic (5nm, N5P)
  • iPhone 14 Pro (2022): A16 Bionic (4nm, N4P)
  • ‌iPhone 15 Pro‌ (2023): A17 Pro (‌3nm‌, N3B)
  • iPhone 16 Pro (2024): “A18” (‌3nm‌, N3E)
  • “‌iPhone‌ 17 Pro” (2025): “A19” (2nm, N2)
  • “‌iPhone‌ 18 Pro” (2026): “A20” (2nm, N2P)
  • “‌iPhone‌ 19 Pro” (2027): “A21” (1.4nm, A14)

The M1 series of Apple silicon chips is based on the A14 Bionic and uses TSMC’s N5 node, while the M2 and M3 series use N5P and N3B, respectively. The Apple Watch’s S4 and S5 chips use N7, the S6, S7, and S8 chips use N7P, and the latest S9 chip uses N4P.

Each successive TSMC node surpasses its predecessor in terms of transistor density, performance, and efficiency. Late last year, it emerged that TSMC had already demonstrated prototype 2nm chips to Apple ahead of their expected introduction in 2025.

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Could Tesla be about to make its own silicon? Even Elon Musk isn’t sure — but let’s wait and see if it wants to take on Samsung and TSMC

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Although tech giants like Samsung and TSMC currently dominate the silicon landscape, Elon Musk has hinted that Tesla could potentially make its own chips in the future – and while the idea remains a tentative one, it’s certainly not beyond the realms of possibility.

Tesla spends a fortune on silicon. Its Dojo ExaPod supercomputer boasts a staggering 1.1 exaflops of computing power dedicated to training machine learning models for Tesla’s self-driving technology. Musk said in February 2024 that the company will spend “over a billion dollars” on Nvidia and AMD hardware this year just to stay competitive in the AI space. Making its own AI chips would be impossible for Tesla, but it could potentially produce chips for its cars.



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Apple Silicon Vulnerability Allows Hackers to Extract Encryption Keys

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An unpatchable vulnerability has been discovered in Apple’s M-series chips that allows attackers to extract secret encryption keys from Macs under certain conditions, according to a newly published academic research paper.

m1 vs m2 air feature toned down
Named “GoFetch,” the type of cyber attack described involves Data Memory-Dependent Prefetchers (DMPs), which try to predict what data the computer will need next and retrieve it in advance. This is meant to make processing faster, but it can unintentionally reveal information about what the computer is doing.

The paper finds that DMPs, especially the ones in Apple’s processors, pose a significant threat to the security provided by constant-time programming models, which are used to write programs so that they take the same amount of time to run, no matter what data they’re dealing with.

The constant-time programming model is meant to protect against side-channel attacks, or types of attacks where someone can gain sensitive information from a computer system without directly accessing it (by observing certain patterns, for example). The idea is that if all operations take the same amount of time, there’s less for an attacker to observe and exploit.

However, the paper finds that DMPs, particularly in Apple silicon, can leak information even if the program is designed not to reveal any patterns in how it accesses memory. The new research finds that the DMPs can sometimes confuse memory content, which causes it to treat the data as an address to perform memory access, which goes against the constant-time model.

The authors present GoFetch as a new type of attack that can exploit this vulnerability in DMPs to extract encryption keys from secure software. The attack works against some popular encryption algorithms that are thought to be resistant to side-channel attacks, including both traditional (e.g. OpenSSL Diffie-Hellman Key Exchange, Go RSA decryption) and post-quantum (e.g. CRYSTALS-Kyber and CRYSTALS-Dilithium) cryptographic methods.

In an email to ArsTechnica, the authors explained:

Prefetchers usually look at addresses of accessed data (ignoring values of accessed data) and try to guess future addresses that might be useful. The DMP is different in this sense as in addition to addresses it also uses the data values in order to make predictions (predict addresses to go to and prefetch). In particular, if a data value “looks like” a pointer, it will be treated as an “address” (where in fact it’s actually not!) and the data from this “address” will be brought to the cache. The arrival of this address into the cache is visible, leaking over cache side channels.

Our attack exploits this fact. We cannot leak encryption keys directly, but what we can do is manipulate intermediate data inside the encryption algorithm to look like a pointer via a chosen input attack. The DMP then sees that the data value “looks like” an address, and brings the data from this “address” into the cache, which leaks the “address.” We don’t care about the data value being prefetched, but the fact that the intermediate data looked like an address is visible via a cache channel and is sufficient to reveal the secret key over time.

In summary, the paper shows that the DMP feature in Apple silicon CPUs could be used to bypass security measures in cryptography software that were thought to protect against such leaks, potentially allowing attackers to access sensitive information, such as a 2048-bit RSA key, in some cases in less than an hour.

According to the authors, the flaw in Apple’s chips cannot be patched directly. Instead, the attack vector can only be reduced by building defenses into third-party cryptographic software that could result in an extreme performance degradation when executing the cryptographic operations, particularly on the earlier M1 and M2 chips. The DMP on the M3, Apple’s latest chip, has a special bit that developers can invoke to disable it, but the researchers aren’t yet sure what kind of penalty will occur when this performance optimization is turned off.

As ArsTechnica notes, this isn’t the first time researchers have identified threats in Apple DMPs. Research documented in 2022 discovered one such threat in both the ‌M1‌ and Apple’s A14 Bionic chip for iPhones, which resulted in the “Augury” attack. However, this attack was ultimately unable to extract the sensitive data when constant-time practices were used.

“GoFetch shows that the DMP is significantly more aggressive than previously thought and thus poses a much greater security risk,” the researchers claim on their website. “Specifically, we find that any value loaded from memory is a candidate for being dereferenced (literally!). This allows us to sidestep many of Augury’s limitations and demonstrate end-to-end attacks on real constant-time code.”

Users concerned about the vulnerability are advised to check for GoFetch mitigation updates that become available in future macOS updates for any of the encryption protocols known to be vulnerable. Apple representatives declined to comment on the record when ArsTechnica asked about the research.

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How to upgrade Apple Silicon laptop soldered SSD storage

How to upgrade Apple Silicon laptop soldered SSD storage

If you’re a MacBook Air user, you might have experienced the frustration of running out of storage space. Especially for those with the M1 MacBook Air, the base storage of 128 GB for the educational laptop versions can quickly become insufficient for modern computing needs. However, there’s a solution that can significantly expand your MacBook’s storage capacity. It’s possible to upgrade your M1 MacBook Air to a whopping 2 TB by installing two 1 TB NAND chips. However MacBook SSD upgrades are not for the faint of heart, as it involves intricate work on the machine’s logic board, but for those with a technical background and a bit of courage, it’s an achievable task.

The M1 MacBook Air is designed with a single NAND chip for storage. To increase the storage, you’ll need to add a second chip. This process requires modifying the logic board, a task that demands precision and a solid understanding of electronics. You’ll be removing the existing NAND and installing additional components that are necessary for the second NAND chip to function properly.

Once you’ve prepared your logic board for the upgrade, the next step is to reball the new NAND chips. This involves attaching tiny solder balls to the contacts on the chip. It’s a delicate process that requires a steady hand and experience with soldering. After that, you’ll need to use a specialized tool, known as the JC P13 programmer, to install the correct firmware onto the NAND chips. It’s crucial to use new, unprogrammed NAND chips to ensure compatibility with your MacBook.

Upgrading Apple Silicon laptop SSDs

Even if you don’t have the skills to do the soldering yourself stiffly worth checking out the tutorial video created by dosdude1 that shows how you can successfully upgrade the SSD storage on an Apple Silicon MacBook if you so wish.

Here are some other articles you may find of interest on the subject of Apple Silicon :

Apple Silicon MacBook SSD upgrade

After the NAND chips are programmed, you’ll have to reinstall macOS to ensure that your MacBook Air recognizes the new 2 TB of storage. However, it’s worth noting that you might encounter issues with read/write speeds after the upgrade. These issues can often be resolved by zeroing out the disk, which can help optimize the system’s use of the new space.

This upgrade process is intricate and requires a high level of technical skill. It’s also important to note that this guide is specific to certain MacBook models, particularly the M1 and M2 MacBook Air models that support dual NAND chips. Attempting this upgrade on unsupported models, such as the M1 Pro, Max, Ultra, and some M2 and M3 models, could result in hardware damage. It’s essential to proceed with caution and consider seeking professional assistance if you’re not confident in your technical abilities.

The idea of upgrading your MacBook Air’s storage might seem daunting, but for those with the necessary skills, it’s a project that can breathe new life into your machine. With an expanded storage capacity, you’ll be able to handle more data-intensive tasks, store more files, and enjoy a more versatile computing experience. Just remember to approach the task with care, and don’t hesitate to seek help if needed. This upgrade could be the key to unlocking the full potential of your MacBook Air, allowing you to work more efficiently and effectively.

Image Credit : dosdude1

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Arduino and Silicon Labs partner to make Matter more accessible

Arduino and Silicon Labs partner to make Matter protocol more accessible

The official Arduino team responsible for creating  awesome microcontrollers and a leading platform in the maker and educational communities, has joined forces with Silicon Labs, a prominent player in the world of microcontrollers and wireless chips. This collaboration is set to bring the Matter protocol, a new standard for smart home devices, into the Arduino environment. This move is significant because it promises to make cutting-edge Internet of Things (IoT) technology more approachable for a wide range of users, from students and hobbyists to professional developers.

At the Consumer Electronics Show (CES) in 2024, the partnership made waves by unveiling a new, easy-to-use Arduino library for the Matter protocol. This library is designed to simplify the process of developing IoT projects. Alongside this, they announced the integration of the Arduino core with Silicon Labs microcontrollers, which now works smoothly with the Arduino Integrated Development Environment (IDE). This integration is a big deal because it makes it easier for people to create and use IoT applications, no matter their level of technical expertise.

Rob Shane, the Vice President of Global Mass Markets at Silicon Labs, expressed his enthusiasm for the partnership. He highlighted the benefits of combining Silicon Labs’ high-tech capabilities with Arduino’s user-friendly approach. This combination is expected to spur innovation in various areas, such as smart home technology, industrial IoT solutions, and educational projects.

Arduino and Silicon Labs

The Arduino community is encouraged to start experimenting with the Matter protocol right away. The new core is compatible with existing boards like the Silabs xG24 Explorer Kit and the Sparkfun Thing Plus Matter. These boards are available for early adopters who want to explore what Matter has to offer.

Glenn Samala, CEO of SparkFun, commented on the importance of bringing Matter into the Arduino world. He believes that this step is key to making IoT development more streamlined and fostering a more connected world.

Looking ahead to Arduino Day in 2024, there’s excitement about the introduction of a new member to the Nano board family. This new board will feature the SiLabs MGM240SD22VNA and is expected to make a significant impact on IoT development with its ease of use and advanced capabilities.

The partnership between Arduino and Silicon Labs is likely to have far-reaching effects for the Arduino community. By making advanced IoT technologies more widely available, it’s expected to spark a wave of creativity in various sectors, including smart homes, industrial IoT, and education.

This collaboration between Arduino and Silicon Labs, with the integration of the Matter protocol into the Arduino ecosystem, represents a major step forward in IoT development. It aims to provide a diverse group of users with the tools they need to create innovative IoT solutions, shaping the future of how devices and applications connect and interact.

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