Hynix

El mayor rival de Samsung presenta los chips HBM3e de 16 capas con 'la mayor capacidad del mundo': SK hynix promete un aumento de rendimiento para todos

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El mayor rival de Samsung presenta los chips HBM3e de 16 capas con 'la mayor capacidad del mundo': SK hynix promete un aumento de rendimiento para todos

Se espera que el chipset HBM3e de 16 capas se lance en 2025 Los nuevos chips proporcionan capacidades mejoradas de aprendizaje y razonamiento de IA Los usuarios pueden esperar una latencia más baja, afirma Sk hynix SK hynix ha anunciado planes para agregar cuatro capas adicionales a sus chips de memoria 12-HI HBM3e en un … Read more

Micron lanza HBM3E de 36 GB para ponerse al día con Samsung y SK Hynix mientras los competidores se apresuran frenéticamente hacia la próxima gran novedad: HBM4 con sus 16 capas, ancho de banda de 1,65 Tbps y SKU de 48 GB.

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Micron lanza HBM3E de 36 GB para ponerse al día con Samsung y SK Hynix mientras los competidores se apresuran frenéticamente hacia la próxima gran novedad: HBM4 con sus 16 capas, ancho de banda de 1,65 Tbps y SKU de 48 GB.

Micron ha lanzado oficialmente su memoria de alto rendimiento HBM3E 12 de 36 GB, lo que marca la entrada de la compañía en el panorama competitivo de las soluciones de memoria de alto rendimiento para… Amnistía Internacional y sistemas basados ​​en datos. A medida que las cargas de trabajo de IA se vuelven más complejas … Read more

Samsung’s archrival strikes crucial partnership with Nvidia’s closest ally to deliver key next-gen memory — SK Hynix teams up with TSMC to advance HBM development but could this move encourage TSMC to become like Intel?

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Samsung’s archrival strikes crucial partnership with Nvidia’s closest ally to deliver key next-gen memory — SK Hynix teams up with TSMC to advance HBM development but could this move encourage TSMC to become like Intel?

South Korean memory giant SK Hynix, which recently announced plans for the construction of the world’s largest chip factory, has now announced a major partnership with top Taiwanese semiconductor foundry, TSMC.  The two firms aim to cement their positions in the fast-growing AI market by developing and producing the next-generation of High Bandwidth Memory, known … Read more

Samsung confirms next generation HBM4 memory is in fact Snowbolt — and reveals it plans to flood the market with precious AI memory amidst growing competition with SK Hynix and Micron

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Samsung confirms next generation HBM4 memory is in fact Snowbolt — and reveals it plans to flood the market with precious AI memory amidst growing competition with SK Hynix and Micron

Samsung has revealed it expects to triple its HBM chip production this year. “Following the third-generation HBM2E and fourth-generation HBM3, which are already in mass production, we plan to produce the 12-layer fifth-generation HBM and 32 gigabit-based 128 GB DDR5 products in large quantities in the first half of the year,” SangJoon Hwang, EVP and … Read more

Samsung’s biggest memory rivals are plotting a tie-up with Kafkaesque implications — SK Hynix and Kioxia could build lucrative HBM chips for Nvidia, AMD and others

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Samsung’s biggest memory rivals are plotting a tie-up with Kafkaesque implications — SK Hynix and Kioxia could build lucrative HBM chips for Nvidia, AMD and others

South Korean chipmaker SK Hynix, a key Nvidia supplier, says it has already sold out of its entire 2024 production of stacked high-bandwidth memory DRAMs, crucial for AI processors in data centers. That’s a problem, given just how in demand HBM chips are right now. However, a solution might have presented itself, as reports say … Read more