Given the codename “Sierra Forest”, that chip will be available in the second half of this year, while customers will have to wait until next year to get their hands on its more powerful “Granite Rapids” sibling.
Intel has now rebranded its Xeon family of processors, replacing the “Xeon Scalable” name, which first hit the market in 2017 with the Xeon Platinum 8100 series, with “Xeon 6.” This new brand will include the all-efficiency (E) Sierra Forest chip and the performance (P) Granite Rapid one.
Amplify performance signals
The Sierra Forest data center chip is the first with an architecture comprised entirely of efficiency cores (E-cores), designed to deliver boost performance of 5G workloads by 2.7 times per rack, according to Intel. When it arrives, Granite Rapids (with P-cores) will build upon the doubled vRAN workload processing capacity offered by Sapphire Rapids and increase performance even further via Intel AVX and vRAN Boost.
Both Granite Rapids and Sierra Forest variants share the same platform (including the chiplet-based design, sockets. memory, and firmware) and thus will use the shared Xeon 6 nomenclature, a move which Intel hopes will make everything clearer for customers.
The company says the “evolved” Xeon 6 branding will “tell a united Intel Xeon story,” “Ease customer navigation,” and “Amplify performance signals”.
Intel’s existing “Emerald Rapids” 5th-Gen Xeon Scalable Processor models won’t see a rebrand. It has been said with the current-gen Xeon product stack that Intel’s branding can be “more than a little confusing”, and the company obviously feels it’s best to start afresh with the new Xeon 6 brand and focus on making things simpler going forward.
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Sony just revealed its lineup of new TVs for 2024. While many boast interesting features that we’ll get into later, the biggest change is naming conventions. Sony TVs used to be named confusing strings of numbers and letters, but that’s all gone now. The names here are clean and simple. They all use Bravia, a long-time Sony moniker for televisions, and a single digit number.
The Bravia 3 is a standard 4K LED TV with dynamic HDR, upscaling technology and a 60Hz refresh rate. This is the most basic box within Sony’s lineup, but it still looks plenty capable. The company promises that it also uses eight percent less power than last year’s equivalent, which is always nice. The TV is available in sizes ranging from 43-inches all the way up to 85-inches, with prices going from $600 to $1,800.
Sony
Don’t ask what happened to Bravia 4, 5 and 6, because the next TV in the lineup is called the Bravia 7. This is a mini LED box with some neat tech, including a powerful updated processor and Sony’s proprietary Backlight Master Drive local dimming algorithm. The company says this allows it to feature 790 percent more dimming zones compared to last year’s similar X90L. The more dimming zones a TV has, the smaller each one will be. This leads to an increase in precision and a better contrast ratio.
It also uses less power than the X90L, to the tune of 15 percent, and boasts a new calibration mode primarily intended for Prime Video content. The Bravia 7 is available in sizes ranging from 55-inches to 85-inches, with prices fluctuating from $1,900 to $3,500.
The Bravia 8 is the company’s latest OLED model. The OLED panel ensures a “perfect black” response and the box includes the same calibration mode for Prime Video found with the Bravia 7. However, the most interesting aspects of this line have to do with size and form factor. The Bravia 8 is 31 percent thinner than last year’s equivalent model, with a slimmed down bezel. It should really pop when hung on a wall. There are only three sizes in this lineup, and the 55-inch model costs $2,000, the 65-inch version costs $3,400 and the 75-inch box costs a whopping $3,900.
Sony
Finally, there’s the flagship Bravia 9. This is basically a souped-up version of the Bravia 7, as its another mini LED box. Sony says that the display technology is similar to what’s found in a mastering monitor, which is a lofty promise. It’s 50 percent brighter than last year’s X95L, which was already plenty bright, with a 325 percent increase in dimming zones.
There’s also a 20 percent reduction in power consumption when compared to the X95L and new beam tweeters for improved audio. The Bravia 9 features Sony’s proprietary Backlight Master Drive and the new Prime Video calibration feature. The 65-inch version of this TV costs $3,300, while the 85-inch model comes in at a jaw-dropping $5,500.
2nm processors made by TSMC will be faster while using less power than today’s 3nm iPhone and Mac chips. Image: Ed Hardy/Cult of Mac
Progress is reportedly going well at Apple’s chipmaker TSMC on development of the 2nm and later 1.4nm processors to power the 2025 through 2027 Mac and iPhone models.
Getting these chips into production is a critical part of keeping Apple at the forefront of technology.
No problems with TSMC developing 2nm and 1.4nm processors
A-series and M-series processors carry the Apple name, and the chips are designed in Cupertino, but they are produced by TSMC using technology the chipmaker develops. The Taiwanese foundry has generally been able to shrink the components of Apple’s chips every year or two, allowing the devices they power to work faster while generating less waste heat.
The A17 Pro in the iPhone 15 Pro models and the M3 chips in the new MacBooks and iMac were all produced with a 3nm process. That’s the best available at this time.
But TSMC is hard at work on the production process that will enable 2nm chips. And past that will be 1.4nm chips — that process is often called A14. Development for these reportedly remains on schedule.
Trial production of 2nm chips should start later this year, with full production beginning in 2025. And all of the initial supply of these might go into iPhone and Mac, according to a published report.
Other computer-makers will benefit, too. TSMC produces chips for a range of companies — Apple is only the most prominent.
Looking farther ahead
An improved version of the 2nm process allegedly will make Apple’s 2026 family of chips. And production of 1.4nm processors is expected to begin in 2027.
Chip development doesn’t always go this smoothly. TSMC ran into problems developing its 3nm production process, and that forced Apple to delay introducing chips that used it by a year.
Over the last couple of years, Samsung has lowered the usage of Exynos chipsets in its phones and tablets. Take the Galaxy S23 series for example. The company used only the Snapdragon 8 Gen 2 chipset for the lineup. The brand is also not using Exynos SoCs in mid-range and low-end devices as much as it used to a few years ago.
While it is clear that the usage of Exynos chipsets is going down, we didn’t have any figures on the trend. Fortunately, that’s changing today. Canalys has just posted a report analyzing the global smartphone market by processor vendor, and it reveals some disappointing news about Exynos chipsets and Samsung Semiconductor.
According to the report, the shipment of smartphones with chipsets from Samsung Semiconductors was 13 million in Q4 2023, which is 48% less compared to that in Q4 2022. As a result, the company’s revenue from smartphone chipsets stood at USD 5 billion in the last quarter, which is 44% lower than what it was in Q4 2022.
Unlike the Galaxy S23 series, Samsung has used Exynos chipset for the Galaxy S24 lineup. So, the shipment of smartphones with Exynos chipsets should go up in this and the upcoming quarters, and with that the revenue of Samsung Semiconductors should also see a steep increase. It would be interesting to see future figures.
The report from Canalys also reveals that MediaTek processors powered the highest number of smartphones (117 million) in Q4 2023. Apple was the second-largest chipset provider with its SoCs powering 78 million smartphones and Qualcomm was the third-largest chipset supplier with its processors powering 69 million smartphones.
Sam Altman, the visionary head of OpenAI,, is spearheading an ambitious initiative poised to revolutionize the technology landscape. His goal is to establish a global network of factories dedicated to producing the specialized silicon processors—the brains behind artificial intelligence. These processors are essential for powering advanced technologies from smarter phones to self-driving cars, marking a significant leap forward in AI capabilities.
This project, with an estimated cost between $5 and $7 trillion, aims not only to advance OpenAI’s technological base but also to catalyze a global shift towards more sophisticated AI applications. Altman’s strategy involves partnering with industry giants, including the Taiwan Semiconductor Manufacturing Company (TSMC), leveraging their expertise to operationalize these advanced manufacturing hubs. These factories are envisioned to be at the forefront of semiconductor technology, producing chips for a wide array of companies eager to harness AI’s full potential.
The initiative emerges against the backdrop of a global chip shortage that has underscored the fragility of the current semiconductor supply chain, heavily reliant on a few key providers like TSMC. This shortage, exacerbated by geopolitical tensions, particularly between Taiwan and China, has prompted significant moves to diversify production and mitigate risks. The U.S. government, recognizing the strategic importance of semiconductor independence, has blocked certain tech transactions and invested in domestic semiconductor R&D, complementing TSMC’s commitment to build a $40 billion chip plant in the United States.
OpenAI AI Silicon Processors
Altman’s vision transcends merely addressing the current chip shortage. It represents a foundational shift towards diversifying chip production globally, reducing the geopolitical risk currently concentrated in the semiconductor industry. This strategic expansion is crucial as AI becomes increasingly integrated into every aspect of our lives, from healthcare to transportation, necessitating reliable and powerful semiconductors.
Financing this colossal venture poses a significant challenge, with Altman and his team in discussions with potential investors capable of supporting such a groundbreaking initiative. Beyond financial investment, the project requires global cooperation and alignment with the vision of a future where AI chips are ubiquitously manufactured worldwide, fostering a new era of technological innovation and independence.
The implications of Altman’s project extend far beyond the current technological landscape. By laying the groundwork for the next generation of AI technologies, this initiative not only aims to solve the immediate issues of chip shortages and geopolitical dependencies but also sets the stage for a future where AI’s potential can be fully realized, ensuring the tech industry can meet the growing demands of AI applications.
However, navigating the intricate web of political and financial challenges remains a formidable task. The endeavor is set against a complex backdrop of international politics and economic considerations, where the strategic importance of semiconductor manufacturing has become a focal point of global attention. As Altman’s project moves forward, it will require careful negotiation and strategic partnerships to realize this bold vision for a technologically empowered future.
Sam Altman’s project is not just an ambitious venture; it’s a visionary leap towards redefining the global semiconductor industry, promising to usher in a new era of technology that could fundamentally change how we interact with the world around us. With high stakes and the world watching, the success of this initiative could signal the dawn of an unprecedented technological age.
Source : Toms Hardware
Filed Under: Technology News, Top News
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At CES 2024 this week Advanced Micro Devices (AMD) will be showcasing its Ryzen 8000G series Accelerated Processing Units (APUs). These new chips are designed to cater to desktop users who need both integrated graphics and AI processing capabilities. AMD’s latest offering includes several models: the Ryzen 7 8700G, Ryzen 5 8600G, Ryzen 5 8500G, and Ryzen 3 8300G. Each of these is tailored to meet the demands of users looking for a seamless computing experience, whether for work or leisure activities.
The Ryzen 8000G series is a noteworthy development for those who rely on integrated graphics. The top-tier models, the Ryzen 7 8700G and Ryzen 5 8600G, are particularly impressive with their inclusion of a neural processing unit (NPU). This addition is aimed at enhancing AI-driven tasks, making these APUs stand out in the market. The Ryzen 7 8700G is built on the 4 nm “Hawk Point” silicon and is equipped with an 8-core/16-thread CPU. It also features a Radeon 780M integrated GPU (iGPU) and boasts an AI throughput of 39 TOPS. The Ryzen 5 8600G, sharing the same “Hawk Point” architecture, offers a 6-core/12-thread CPU and a Radeon 760M iGPU, with a 16 TOPS AI throughput.
For those who prioritize energy efficiency, the Ryzen 5 8500G and Ryzen 3 8300G are based on the “Phoenix 2” silicon. These models combine “Zen 4” and “Zen 4c” cores and are equipped with the Radeon 740M iGPU. While they do not feature an NPU, they offer a balanced performance that is mindful of power consumption.
“AMD continues to lead the AI hardware revolution by offering the broadest portfolio of processors with dedicated AI engines in the x86 market,” said Jack Huynh, senior vice president and general manager, Computing and Graphics Group at AMD. “Last year at CES, we introduced the first dedicated AI engine in an x86 processor for the mobile market. This year, we are expanding our AI leadership to desktop computing through our Ryzen 8000G Series processors. We’re excited to lead the AI PC era together with our close OEM and ecosystem partners.”
Ryzen 5000 Series desktop processors
AMD’s new series is set to compete with Intel’s 13th Gen Core desktop processors, particularly in scenarios where users require strong integrated graphics performance. The Ryzen 8000G series presents a compelling option for those who prefer not to invest in a separate graphics card, offering robust graphics capabilities that can handle a variety of tasks.
The APUs are scheduled to hit the market on January 31, with the Ryzen 7 8700G priced at $329, the Ryzen 5 8600G at $229, and the Ryzen 5 8500G at $179. These price points are set to make the series accessible to a wide range of users. The APUs are designed to enhance the experience for casual gaming, high-definition content viewing, and multi-monitor setups.
The Ryzen 7 8700G and Ryzen 5 8600G also come with features such as AMD HyperRX, which promises smoother gaming experiences, and unlocked multipliers that offer the potential for overclocking. Additionally, they support AMD EXPO memory modules, which are intended to increase system speed and responsiveness.
One aspect to consider is that the “Hawk Point” silicon does not support PCI-Express Gen 5, which could impact PCIe configurations on AM5 motherboards. However, this may not be a significant issue for all users, depending on their specific needs and system configurations.
AMD’s Ryzen 8000G series stands out for its AI integration and robust graphics capabilities, making it a versatile choice for a wide array of desktop users. The inclusion of Ryzen AI in select models underscores AMD’s commitment to advancing computing capabilities. With these APUs, AMD is offering a range of options that promise to meet the needs of various users, from those seeking energy efficiency to those requiring high-performance graphics and AI processing. The Ryzen 8000G series is compatible with the latest Socket AM5 and supports motherboards with AMD X670/E, B650/E, and A620 chipsets, ensuring that users can take advantage of the latest technological advancements.
“We’re excited to launch the latest laptops, including the ROG Zephyrus G14 and the ASUS TUF Gaming A15 and A16, all featuring Ryzen 8040 processors aimed at delivering the most exhilarating on-the-go gaming experiences to our customers,” said ASUS Co-CEO S.Y. Hsu. “We’ve completely redefined mobile gaming by partnering with AMD. The new Ryzen 8040 Series processors will provide customers with the highest quality gameplay for hours without drops in speed or game stuttering.”
As the computing landscape continues to shift towards more integrated and efficient systems, AMD’s Ryzen 8000G series APUs represent a significant step forward. They offer a blend of performance, efficiency, and advanced features that are likely to appeal to a broad spectrum of users. Whether for gaming, content creation, or everyday productivity, these APUs are poised to deliver a powerful and flexible computing experience.
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In the rapidly evolving world of technology, Marvell Technology has once again made a significant mark with the introduction of two new OCTEON 10 data processing units (DPUs), the OCTEON 10 CN102 and OCTEON 10 CN103 networking processors. These innovative units are designed to enhance the performance and efficiency of networking equipment and firewall manufacturers, bringing server-class performance to networking devices.
The OCTEON 10 CN102 and CN103 are optimized for data and control plane applications in various devices such as routers, firewalls, 5G small cells, SD-WAN appliances, and control plane applications in top-of-rack switches and line card controllers. These units are manufactured using 5 nm process technology, showcasing the company’s commitment to staying at the forefront of technology innovation.
OCTEON 10 DPU platform
These new DPUs from Marvell Technology deliver three times the performance of the company’s current DPU solutions, a significant leap in processing power. But it’s not just about increased performance. Marvell has also managed to reduce power consumption by 50% to 25 W, a critical factor in today’s energy-conscious world. These units can serve as an offload DPU for host processors or as the primary processor in devices, offering flexibility in application.
The OCTEON 10 DPU platform, first announced in 2021, was designed to meet the growing requirements for network, storage, and security processing among various end users. It shares a common foundation of 5 nm process technology, Arm Neoverse N2 processors, hardware accelerators, industry-leading I/O, and DDR5 support, among other technologies.
Marvell’s approach to the OCTEON 10 DPU platform is based on the idea that every market and customer segment deserves optimized processors. To this end, the company varies the number of CPU cores, the optimal data paths, the type and number of hardware accelerators, and other technologies to create different models optimized for specific applications, customer segments, and performance requirements. This approach allows Marvell to cater to a wide range of customer needs and applications. Here are some other articles you may find of interest on the subject of networking :
Networking processors
The OCTEON 10 CN102 and CN103 are part of Marvell’s broader compute strategy to increase overall performance while holding down power and chip cost. This strategy is key to the company’s commitment to delivering high-performance, energy-efficient solutions to its customers.
Marvell’s OCTEON technology has been incorporated into platforms by carriers, equipment vendors, and other semiconductor designers. The new OCTEON 10 CN102 and CN103 continue this trend, delivering technology usually associated with hyperscale cloud data centers for accelerating network, storage, and security workloads to OEMs and enterprises.
Other OCTEON 10 DPUs include OCTEON 10 CN106, designed for cloud, enterprise, and baseband for 5G wireless networks, and OCTEON 10 Fusion CN105, optimized for the intense radio processing demands of massive MIMO and other 5G RAN tasks. These units further highlight the versatility and range of the OCTEON 10 DPU platform.
In terms of availability, the OCTEON 10 CN102 and CN103 DPUs are set to be available in production quantities in Q4 of this year and Q1 of 2024, respectively. This timeline highlights Marvell’s commitment to delivering its innovative solutions to customers in a timely manner.
The introduction of the new OCTEON 10 CN102 and CN103 DPUs by Marvell Technology marks a significant step forward in the realm of data processing units. With improved performance, reduced power consumption, and application in a wide range of devices, these units are set to bring server-class performance to networking devices, meeting and exceeding the demands of today’s technology landscape.
Source: Marvell
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The world of high-performance industrial applications has been invigorated with the announcement of AMD’s Ryzen Embedded 7000 Series processor family. This announcement, made at Smart Production Solutions 2023, marks a significant milestone in the embedded market, introducing a series of processors that combine AMD’s “Zen 4” architecture and integrated Radeon graphics. This fusion of technology offers a level of performance and functionality that was previously unavailable in the embedded market.
The AMD Ryzen 7000 Series is a pioneering product line, being the first embedded processor to utilize 5 nm technology. This advancement is accompanied by a 7-year manufacturing availability commitment from AMD, showcasing the company’s dedication to long-term support and reliability. The use of 5 nm technology is a significant step forward, potentially enabling greater efficiency and performance in a variety of industrial applications.
Ryzen Embedded 7000 Series processors features:
“Zen 4” architecture, featuring up to 12 high-performance CPU cores
Integrated Radeon RNDA2 graphics 1 WGP @ 2.20 GHz max
AM5 socket, LGA 40 mm x 40 mm, 1718 pin
TDP from 65 W to 105 W
Support for Dual-Channel ECC DDR5 memory at speeds up to 5200MT/s
Up to 28 lanes of PCIe 5 connectivity on-chip
One of the standout features of the Ryzen Embedded 7000 Series processors is the integration of AMD Radeon RDNA 2 graphics. This integration eliminates the need for a separate GPU for industrial applications, simplifying system design and potentially reducing overall system costs. This integrated approach could be a game-changer in the industrial sector, where streamlined, efficient systems are highly valued.
The Ryzen Embedded 7000 Series processors are versatile and adaptable, supporting both Windows Server and Linux Ubuntu, in addition to Windows 10 and Windows 11. This broad compatibility makes these processors a flexible solution for a wide range of applications and environments.
Zen 4 architecture
The processors are designed with up to 12 high-performance “Zen 4” CPU cores, offering ease of integration for system designers. This high core count, combined with the powerful “Zen 4” architecture, can provide exceptional processing power for demanding applications. This level of performance could be particularly beneficial in applications such as advanced robotics, instrumentation design, power control, and video surveillance, among others.
Several industry leaders, including Advantech, ASRock Industrial, and DFI, have expressed support for the new processors. This endorsement highlights the potential of the Ryzen Embedded 7000 Series processors to enhance performance in various industrial applications.
The Ryzen Embedded 7000 Series processors come packed with features. They boast up to 12 high-performance CPU cores, integrated Radeon RNDA2 graphics, and an AM5 socket. They also offer a TDP range from 65 W to 105 W, support for Dual-Channel ECC DDR5 memory at speeds up to 5200MT/s, and up to 28 lanes of PCIe 5 connectivity on-chip. These features make them a formidable option for high-performance industrial applications.
The announcement of the Ryzen Embedded 7000 Series processors marks a significant advancement in the embedded market. With their cutting-edge technology and impressive feature set, these processors are poised to bring new levels of performance and functionality to a wide range of industrial applications.
Source : AMD
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