Tag: motherboard

The socket is the motherboard, Part 2 — Intel archrival (and Nvidia’s BFF) plans to build giant chips that could use kilowatts of power but they won’t be as big as Cerebras trillion transistor behemoth

Post author By lisa nichols
Post date May 11, 2024
No Comments on The socket is the motherboard, Part 2 — Intel archrival (and Nvidia’s BFF) plans to build giant chips that could use kilowatts of power but they won’t be as big as Cerebras trillion transistor behemoth

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A few weeks ago, we wrote how Eliyan’s NuLink PHY could do away with silicon interposers and integrate everything into an single, elegant package. How, essentially, the socket could become the motherboard.

At the recent 30th annual North America Technology Symposium, the Taiwan Semiconductor Manufacturing Company (TSMC) revealed plans to construct a version of its chip-on-wafer-on-substrate (CoWoS) packaging technology that could lead to system-in-packages (SiPs) over twice the size of the current largest ones.

“With System-on-Wafer, TSMC is providing a revolutionary new option to enable a large array of dies on a 300mm wafer, offering more compute power while occupying far less data center space and boosting performance per watt by orders of magnitude,” the company said.

An enormous amount of power

TSMC’s first SoW offering, a logic-only wafer based on Integrated Fan-Out (InFO) technology, is already in production.

A chip-on-wafer version using CoWoS technology is expected to arrive in 2027, and will enable the “integration of SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to a data center server rack, or even an entire server.“

Reporting on the move, Tom’s Hardware expands on this saying, “One of the designs that TSMC envisions relies on four stacked SoICs mated with 12 HBM4 memory stacks and additional I/O dies. Such a giant will certainly draw an enormous amount of power – we are talking about thousands of watts here and will need a very sophisticated cooling technology. TSMC also expects such solutions to use a 120x120mm substrate.”

TSMC’s ambitious pursuit to create gigantic chips, however, is dwarfed by Cerebras Systems’ newest Wafer Scale Engine 3 (WSE-3), termed the “fastest AI chip in the world”. The WSE-3 boasts four trillion transistors and is twice as powerful as its predecessor, the WSE-2, while maintaining the same energy consumption and price. This new chip created on a 5nm TSMC process, provides a staggering peak AI performance of 125 petaflops – which is equivalent to 62 Nvidia H100 GPUs.

Intel quietly launched mysterious new AI CPU that promises to bring deep learning inference and computing to the edge — but you won’t be able to plug them in a motherboard anytime soon

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Intel has launched a new AI processor series for the edge, promising industrial-class deep learning inference. The new ‘Amston Lake’ Atom x7000RE chips offer up to double the cores and twice the higher graphics base frequency as the previous x6000RE series, all neatly packed within a 6W–12W BGA package.

The x7000RE series packs more performance into a smaller footprint. Boasting up to eight E-cores it supports LPDDR5/DDR5/DDR4 memory and up to nine PCIe 3.0 lanes, delivering robust multitasking capabilities.

Intel says its new processors are designed to withstand challenging conditions, enduring extreme temperature variations, shock, and vibration, and to operate in hard-to-reach locations. They offer 2x SATA Gen 3.2 ports, up to 4x USB 3.2 Gen 2 ports, a USB Type-C port, 2.5GbE Ethernet connection, along with Intel Wi-Fi, Bluetooth, and 5G platform capabilities.

Embedded, industrial, and communication

The x7000RE series consists of four SKUs, all suitable for embedded, industrial, and communication use under extended temperature conditions. The x7211RE and x7213RE have 2 cores and relatively lower base frequencies, while the x7433RE has 4 cores, and the x7835RE has 8 cores with higher base frequencies.

All four SKUs support a GPU execution unit count of either 16 or 32, and Intel’s Time Coordinated Computing and Time-Sensitive Networking GbE features. The x7000RE offer integrated Intel UHD Graphics, Intel DL Boost, Intel AVX2 with INT8 support, and OpenVINO toolkit support.

Intel says the chips will allow customers to easily deploy deep learning inference at the industrial edge and in smart cities, and “enhance computer vision solutions with built-in AI capabilities and ecosystem-enabled camera modules” as well as “capture power- and cost-efficient performance to enable latency-bounded workloads in robotics and automation.”

‘The socket is becoming the motherboard’ — how a Samsung-backed startup wants to change computing forever by integrating everything in an elegant packaging to tackle the AI beast once and for all

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Many system designers are exploring chiplet-based SiPs that move beyond the limitations and costs of huge single-die implementations, but which depend heavily on silicon interposers as substrates for mounting and interconnecting the dies.

Silicon interposers deliver a higher data rate than organic substrates, but are not without drawbacks. They are costly, proprietary and limit the number of chiplets that can be placed on one substrate due to size restrictions, while increasing TCO.

Many CPUs are multi-die assemblies which make use of organic substrates (implemented using chiplet interconnect standards like UCIe and the Open Compute Project’s Bunch of Wires (BoW)), but they can’t compete performance-wise with silicon interposers.

Build a better ‘Blackwell’

Now, Eliyan has come up with what it believes is a viable solution that offers the performance advantages of silicon interposers but without their limitations. The solution to this dilemma, the firm says, is to look at the dies themselves – “at the tiny electronic circuits that drive the interconnect lines”. Most of today’s chiplet interconnect standards use a physical-layer (PHY) IP block, but Eliyan’s NuLink PHY reportedly reaches the same maximum performance levels on organic substrates that alternative PHYs can only achieve on silicon interposers.

The company says NuLink PHY, “enables systems with higher performance (more memory) and lower TCO (no interposer),” with results that deliver up to 4x the bandwidth, 4x the power efficiency, up to 4x the SiP size and up to 10x the AI performance.

Eliyan’s Co-founder and chief executive officer Ramin Farjadrad recently talked to The Next Platform about how NuLink PHY can be used to “build better, cheaper, and more powerful compute engines than can be done with current packaging techniques based on silicon interposers.”

The article, titled “How To Build A Better ‘Blackwell’ GPU Than Nvidia Did”, explains how its technology could be used to significantly improve on Nvidia’s superchip design.

It’s a fascinating read, and hints at what could be possible in the future. As The Next Platform’s Timothy Prickett Morgan sums up, “Any memory, any co-packaged optics, any PCI-Express or other controller, can be linked using NuLink to any XPU. At this point, the socket really has become the motherboard.”

There’s certainly a lot of interest in Eliyan’s NuLink PHY. The company recently closed a $60 Million Series B funding round, co-led by Samsung Catalyst Fund and Tiger Global Management. “This investment reflects the confidence in our approach to integrating multi-chip architectures that address the critical challenges of high costs, low yield, power consumption, manufacturing complexity, and size limitations,” Farjadrad said, following the funding announcement.

Apple III motherboard gets bizarre ‘fix’

Post author By miranda cosgrove
Post date April 15, 2024
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April 15: Today in Apple history: Apple scrambles to fix doomed Apple III April 15, 1981: Apple CEO Mike Markkula defends the struggling Apple III with a surprisingly straightforward admission. The comment comes even as the company pushes an unorthodox “fix” for the Apple III motherboard, which tends to overheat due to a questionable design.

“It would be dishonest for me to sit here and say that it’s perfect,” he tells The Wall Street Journal, after critics blast the new computer for its overheating motherboard. Apple’s official solution to the problem? Ask users to drop their Apple III from a height of 6 inches, thereby hopefully reseating the chips.

Apple III: Apple’s first flop

Apple introduced the troubled Apple III, which would become Cupertino’s first official flop, in May 1980. On paper, the Apple II’s doomed successor should have been a massive success. For the first time, this wasn’t a computer singlehandedly built on virtually no budget by Apple co-founder Steve Wozniak. Instead, it was the work of a committee of talented engineers working for a well-funded company.

Unfortunately, this meant the computer suffered from a confused identity. Everyone harbored their own ideas about what it should do. The result: “feature creep,” and a project that took longer than it should have. And, of course, that overheating Apple III motherboard.

An Apple computer built for business

From Apple’s perspective, one of the imperatives of the Apple III was that it should be a business computer. Although sales of the Apple II showed no signs of slowing down, and the Macintosh project was just getting started, Apple wanted a computer that would appeal to companies. The IBM PC was already heavily rumored, and Apple wanted to construct a machine that could shoot it down.

The original Apple III boasted a 2 MHz SynerTek 6502A processor, 2KB of ROM, 128KB on-board RAM and four slots for peripherals. It ran twice as fast as the Apple II and was Apple’s first computer to come with a built-in 5.25-inch floppy drive.

The computer could emulate the Apple II, but came with its own Sophisticated Operating System. Cupertino pronounced it “soss” (like “Apple sauce”). Instead, people referred to it as “S.O.S.” when the full scale of the Apple III disaster became apparent.

Big problems from Day 1

An advertisement shows the Apple III in all its (relative) glory. The ad doesn't mention the overheating Apple III motherboard, naturally. — The Apple III in all its (relative) glory. The ad doesn’t mention the overheating motherboard, naturally.
Photo: Apple

A few big problems accompanied the Apple III rollout. Production delays meant that volume shipments of the computer did not begin until March 1981.

The price, which ranged from $4,340 to $7,800, proved another sticking point. By present standards, a fully kitted-out model cost nearly $27,000, adjusted for inflation.

Apple III’s motherboard overheats

The Apple III’s motherboard problem took the cake, though.

Steve Jobs insisted that the computer not feature a cooling fan. He also dictated the Apple III’s size and shape, without concern for what this would mean for electrical engineers. This resulted in the overheating motherboard, and Apple’s “just drop your computer” workaround.

Apple did do more than this to try and make good, however. It promised to swap out bad Apple III models for new ones, no questions asked. It later launched an upgraded Apple III, which arrived in December 1981.

Sadly, by that point, it was too little, too late. By the end of 1983, months before the Macintosh 128K launched, Apple had sold only 75,000 Apple III computers.

To put that number in context, the Apple II — which the Apple III was designed to replace — sold close to that number every month at the time.

Were you an Apple III owner? Did you experience an Apple III motherboard problem? Let us know in the comments below.

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Tags Apple, bizarre, fix, III, motherboard

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Maingear launches gorgeous gaming PCs with even sleeker motherboard cable management

Post author By lisa nichols
Post date March 13, 2024
No Comments on Maingear launches gorgeous gaming PCs with even sleeker motherboard cable management

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Maingear announced its latest line of gaming PCs, which not only boasts a beautiful aesthetic but also feature truly unique: hidden motherboard cables.

The Zero series not only has one of the cleanest designs I’ve ever seen among the best gaming PCs, but it also uses MG-RC (Maingear Rear Connection) technology. It combines a stunning chassis interior through incredible cable management but also promotes optimal airflow and component upgrades that are much more simplified to make.

Zero series gaming PCs are built with MSI‘s MAG Pano M100 PZ MATX chassis, which are meant for MG-RC-equipped motherboards. They also come equipped with MSI Project Zero motherboards featuring MG-RC rear connectors. This allows the motherboard cabled connections to be pushed to the rear/underside, which ensures a cable-free appearance on the inside of the PC case.

The starting price is $1,399 (around £1,095 / AU$2,115), which is rather affordable and could even be listed as one of the best budget gaming PCs.

black gaming PC with glass side

(Image credit: Maingear)

Maingear is on to something

It’s interesting how the Zero series we have now started off as the Zero Limited Edition gaming PC. This original run only had 50 units total, which is an incredibly low amount and clearly sold out fast enough to warrant a more permanent product.

The MSI B760M Project Zero motherboard was paired with the MSI MAG Pano M1000 PZ White chassis, making for a particularly striking combo. And just like the current Zero series, this limited edition version uses MG-RC to great effect here too.

Though it’s a bit intricate now, hopefully, the concept of moving around the motherboard cables as well as any other components sticks around. Cable management is something gamers always struggle with, especially with how components are built within the chassis in the first place.

Something as simple as having cables feed through the back instead of the front is absolutely mind-blowing in how simple yet effective it is. If more manufacturers could pull off similar feats, it would change gaming PC design for the better.

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Tags Cable, Gaming, gorgeous, launches, Maingear, Management, motherboard, PCs, sleeker

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BIOSTAR BIQ67-AHP Intel LGA1700 industrial motherboard

Post author By miranda cosgrove
Post date January 2, 2024
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BIOSTAR BIQ67-AHP Intel Core i7 i5 i3 processor LGA1700 industrial motherboard

BIOSTAR manufacturer of motherboards, graphics cards, and storage devices, has recently unveiled the BIQ67-AHP, an industrial motherboard designed to accommodate the needs of both industrial and business applications. The BIQ67-AHP industrial motherboard is a robust and efficient solution that streamlines complex processes and operations, acting as a linchpin in managing and facilitating system integration.

One of the most notable features of the BIQ67-AHP is its compatibility with the Intel Core i7/i5/i3 processor (LGA1700). This compatibility is further enhanced by the integration of the Intel Q670 chipset and a Thermal Design Power (TDP) of 125 W. This combination ensures a high-performance computing platform that can handle demanding industrial and business applications.

Intel industrial motherboard

Memory capacity is a critical factor in the performance of any computing system. The BIQ67-AHP industrial motherboard stands out with its high-capacity memory support, featuring four DDR4 3200 MHz LONG-DIMM slots. This feature enhances data reliability and system stability, providing a robust platform for demanding applications.

The BIQ67-AHP is designed to meet the diverse needs of various sectors. It is an ideal solution for System Integration (SI) businesses, AIOT machines, Automation machines, Edge Computing devices, Human-Machine Interface (HMI) systems, and Digital Signage enthusiasts. Its versatile design and robust performance make it a reliable choice for a broad range of audiences.

BIOSTAR BIQ67-AHP

Display output options are abundant on the BIQ67-AHP. It supports multiple display outputs, including VGA, 2x HDMI 2.0, and one DP++. This variety of output options ensures that the motherboard can handle a wide range of display requirements, making it adaptable to various industrial and business applications.

Specifications :

Support Intel Core i7/i5/i3 processor (LGA1700) with Intel Q670 chipset, TDP: 125W
Support display output : VGA/2xHDMI 2.0/DP++
4 x DDR4 3200 MHz LONG-DIMM, Support ECC Function
1 x Intel I226-V GbE LAN, 1 x Intel I226-LM GbE LAN
4 x USB2.0 & 8 x USB3.2
4 x RS232, 2 x RS232/422/485
8 x SATAIII
1x M.2 M KEY socket, support PCIe Gen4 x4 for storage
1x M.2 B KEY socket, support PCIe x1 and USB for 5G
1x M.2 E KEY socket, support PCIe x1 and USB for WIFI/BT
2 x PCIEx16 slot
3 x PCIEx4 slot
2 x PCI slot
Support 0 ~ 60 degree C operating temperature
Power Supply: ATX power input

In terms of connectivity, the BIQ67-AHP industrial motherboard is outfitted with a wide range of ports and slots. It features an array of USB ports, RS232 and RS232/422/485 ports for serial communications, and 8x SATA III ports. Additionally, it includes specialized M.2 sockets for PCIe Gen 4 x4, 5G, and WIFI/BT connectivity. The motherboard also comes with 2x PCIE x16 slots, 3x PCIE x4 slots, and 2x PCI slots, providing ample expansion capabilities.

The BIQ67-AHP is designed to operate in a wide temperature range of 0 to 60 degrees Celsius, making it suitable for various industrial environments. It is powered by an ATX power input, ensuring reliable and steady power supply for all its operations.

The BIQ67-AHP industrial motherboard by BIOSTAR is a testament to the company’s commitment to innovation and excellence in industrial computing. It sets new standards for system integration and industrial performance, providing a robust and efficient solution for managing and streamlining complex processes and operations. It is a versatile and reliable choice that meets the diverse needs of various sectors, from System Integration businesses to AIOT machines and Digital Signage enthusiasts.

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Tags BIOSTAR, BIQ67AHP, Industrial, Intel, LGA1700, motherboard

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ASRock AMD Ryzen 8040 mini PCs and motherboard unveiled

Post author By miranda cosgrove
Post date December 14, 2023
No Comments on ASRock AMD Ryzen 8040 mini PCs and motherboard unveiled

ASRock AMD Ryzen 8040 mini PCs

ASRock Industrial has unveiled its cutting-edge 4X4 BOX 8040 Series Mini PCs and 4X4 8040 Motherboard Series, both of which are powered by AMD Ryzen 8040 Series APUs. These new products are set to revolutionize the market with their impressive specifications and advanced features, setting new benchmarks for performance and versatility.

At the heart of these new products is the AMD Ryzen 8040 Series APUs, which feature up to 8 “Zen 4” cores and 16 threads. This powerful core configuration is complemented by AMD Radeon 700M graphics, delivering a seamless visual experience for users. The 4X4 BOX 8040 Series and 4X4 8040 Motherboard Series are also equipped with AMD Ryzen AI, boasting 16 NPU TOPS. This results in a significant 1.6x increase in AI processing performance compared to its predecessor, which is a testament to the advancements made by ASRock Industrial in this domain.

The 4X4 BOX 8040 Series supports dual-channel DDR5 5600 MHz memory up to 96 GB, providing a robust platform for demanding applications. In terms of connectivity, the series offers a comprehensive array of options, including 4K quad-display outputs, five USB ports, dual storages, dual LAN up to 2.5G, and Wi-Fi 6E support. This makes the 4X4 BOX 8040 Series a versatile solution for a wide range of computing needs.

ASRock AMD Ryzen 8040 motherboard

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The 4X4 BOX 8040 Series includes two specific models: the 4X4 BOX-8840U and 4X4 BOX-8640U. Both are powered by AMD Ryzen 8040 Series APUs, specifically the Ryzen 7 8840U and Ryzen 5 8640U, respectively. With the integration of the CPU, GPU, and NPU, these models offer up to a 1.6x surge in AI processing performance and a 40% speed increase in running AI LLM models compared to previous generation AMD APUs.

In addition to the 4X4 BOX 8040 Series, ASRock Industrial has also introduced the 4X4 8040 Motherboard Series. This series mirrors many of the features found in the mini PCs, including support for two SO-DIMM DDR5 5600 MHz up to 96 GB memory, 2.5G LAN and 1G LAN, and 4K quad-display support with AMD Radeon 700M Graphics. The motherboard series also supports dual storage options and excels in I/O connectivity and expansions.

The 4X4 BOX 8040 Series and 4X4 8040 Motherboard Series are more than just powerful and versatile computing solutions. With their enhanced AI processing capabilities, they are ideally suited for various AIoT applications. Moreover, their compact size and enriched I/O connectivity make them a convenient and efficient choice for a wide range of use cases.

The release of ASRock Industrial’s new 4X4 BOX 8040 Series Mini PCs and 4X4 8040 Motherboard Series, powered by AMD Ryzen 8040 Series APUs, marks a significant step forward in the realm of compact computing solutions. By combining powerful processing capabilities with advanced connectivity options and AI processing enhancements, these new offerings are poised to redefine expectations and set new standards in the industry.

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Tags AMD, ASRock, mini, motherboard, PCs, Ryzen, unveiled

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New BIOSTAR H510MHP-E 3.0 motherboard

Post author By miranda cosgrove
Post date December 8, 2023
No Comments on New BIOSTAR H510MHP-E 3.0 motherboard

New BIOSTAR H510MHP-E 3.0 motherboard

The technology world is abuzz with the introduction of BIOSTAR’s new H510MHP-E 3.0 motherboard, a versatile and powerful addition to the company’s line-up. This motherboard is designed to run with 10th and 11th Generation Intel Core Processors, making it a potent choice for a wide range of users – from office workers and home entertainment enthusiasts to system integrators and those seeking high performance for holiday season HTPC setups.

The H510MHP-E 3.0 motherboard’s compatibility with both 10th and 11th-generation Intel Core processors is a significant advantage. This feature broadens its user base and ensures it can deliver reliable performance across various applications. The motherboard is built on the efficient Intel H470 single-chip architecture, which further enhances its performance and reliability.

One of the standout features of the H510MHP-E 3.0 motherboard is its support for up to 64 GB of dual-channel DDR4 memory. This capability makes it an ideal choice for users who regularly juggle multiple applications or run performance-intensive programs. The motherboard also supports PCIe 3.0 and includes a PCIe 3.0 M.2 slot. This feature is particularly beneficial for high-speed SSDs, offering faster data transfer rates and improved overall system performance.

BIOSTAR H510MHP-E 3.0 motherboard

In addition to its robust processing and memory capabilities, the H510MHP-E 3.0 motherboard also excels in connectivity. It features USB 3.2 Gen 1 support, which significantly enhances data transfer efficiency between devices. This feature is particularly beneficial for users who frequently move large files or require swift peripheral connectivity.

The comprehensive rear I/O panel is another highlight of the H510MHP-E 3.0 motherboard. This panel includes HDMI and VGA ports, allowing users to connect external displays easily. It also includes two USB 3.2 Gen 1 ports and two USB 2.0 ports for a range of peripheral devices, along with a LAN port powered by Realtek RTL8111H technology for reliable networking.

Wireless connectivity is another critical feature of the H510MHP-E 3.0 motherboard, with a WiFi antenna port included. This feature allows users to connect to wireless networks easily, offering greater flexibility and convenience. Additionally, the motherboard features three audio jacks for high-definition audio support, enhancing the multimedia experience.

The H510MHP-E 3.0 motherboard represents BIOSTAR’s continued commitment to delivering cutting-edge technology and exceptional performance. Whether you’re looking to upgrade an existing system, build a new one, or find a reliable solution for various computing needs, this motherboard is a compelling option. Its combination of robust processing capabilities, generous memory support, comprehensive connectivity options, and versatile use make it a standout choice in the current market.

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BIOSTAR B650MT motherboard and AMD Ryzen 5 bundle

Post author By miranda cosgrove
Post date December 1, 2023
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New BIOSTAR B650MT Motherboard and AMD Ryzen 5 PRO 7645 combination bundle unveiled

BIOSTAR has announced the availability of a new combination bundle consisting of the B650MT motherboard and the AMD Ryzen 5 PRO 7645 processor, a high-performance unit from AMD’s acclaimed Ryzen series. Together, these two components promise to deliver exceptional performance, efficiency, and security, meeting the diverse demands of the modern workplace.

The BIOSTAR B650MT motherboard is a marvel of engineering, packed full of features designed to optimize system performance and longevity. One of its standout features is its support for up to 96 GB of DDR5 memory. This substantial memory capacity ensures seamless multitasking and exceptional system responsiveness, critical for demanding business applications.

In addition, the B650MT offers a versatile storage solution. With an M.2 slot and four SATA III ports, users can enjoy fast data access and ample storage capacity. This flexibility in storage options is a boon for businesses that handle large volumes of data daily.

AMD Ryzen 5 motherboard bundle

BIOSTAR’s signature features are also present in the B650MT Motherboard. These include Super Durable Solid Caps, Super Durable Inductor, and Super Hyper PWM. These features ensure a dependable and long-lasting system, a critical factor for businesses that cannot afford frequent system failures and downtime.

On the other hand, the AMD Ryzen 5 PRO 7645 processor is a high-performance unit specifically designed for the modern-day business sector. It offers top-notch performance, cutting-edge security features, and energy efficiency. The processor is powered by the AMD Zen 4 architecture and comes with integrated AMD Radeon Graphics. This setup simplifies integration, management, and administration tasks, reducing the technical overhead for businesses.

The AMD Ryzen 5 PRO 7645 processor is also a powerhouse when it comes to multitasking and demanding tasks. With six cores and twelve threads, the processor’s fast clock speeds reach up to 5.10 GHz. This high clock speed is ideal for running multiple applications simultaneously without compromising system performance.

BIOSTAR B650MT

When combined, the B650MT motherboard and the AMD Ryzen 5 PRO 7645 processor create a formidable computing solution ideal for business use. This combination offers robust security features, advanced performance, and a highly functional and secure computing environment. It integrates seamlessly into versatile business and work environments, making it an ideal choice for professionals seeking a versatile and efficient computing solution.

The combination of the B650MT Motherboard and Ryzen 5 PRO 7645 processor also stands out in the market due to its high level of performance, efficiency, and versatility. The processor’s built-in GPU and the motherboard’s support for the latest hardware make this combination one of the top choices in the market.

In summary, the new BIOSTAR B650MT motherboard and AMD Ryzen 5 PRO 7645 processor combination bundle is a significant development in the computing industry. It promises to deliver high performance, robust security, and exceptional efficiency, making it an ideal solution for both business and casual use. Its versatility and integration into various work environments further enhance its appeal, making it a strong contender in the market.

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MINISFORUM BD 770i AMD mini ITX motherboard

Post author By miranda cosgrove
Post date November 30, 2023
No Comments on MINISFORUM BD 770i AMD mini ITX motherboard

AMD Ryzen 7 7745HX CPU with 8 cores and 16 threads based on Zen 4 architecture

In an era where compact computing is not just a convenience but a necessity, the MINISFORUM BD 770i mini ITX motherboard is with more investigation. Equipped with in AMD Ryzen 7 7745HX CPU, leveraging the advanced Zen 4 architecture to deliver a powerhouse performance with 8 cores and 16 threads. Designed for gamers and PC enthusiasts in a small form factor, this motherboard seamlessly blends size with capability.

Its pre-installed CPU cooler and additional fan space ensure efficient heat management, while the integrated M.2 SSD cooler maintains peak storage performance. Enhanced connectivity options, including a 2.5Gb Ethernet port and multiple USB interfaces, cater to various peripheral needs.

With dual-channel SODIMM DDR5 memory support and two M.2 2280 PCIe 5.0 SSD slots, it sets a new standard in speedy data processing and access. This technological marvel, priced at an accessible $399, is an embodiment of innovation, offering a robust platform for those seeking to build a compact yet powerful mini-ITX system.

AMD mini ITX motherboard

MINISFORUM BD 770i motherboard

The MINISFORUM BD 770i mini-ITX motherboard is designed as a compact powerhouse that’s perfect for gamers and PC enthusiasts who want to build a small form factor system without compromising on capabilities. At the heart of the MINISFORUM BD 770i is the AMD Ryzen 7 7745HX CPU, which is based on the cutting-edge Zen 4 architecture. This processor is a force to be reckoned with, boasting 8 cores and 16 threads. It’s ideal for gaming, streaming, and multitasking, providing the efficiency and speed that modern computing demands.

Keeping your system cool is critical, especially when you’re pushing it to its limits. The MINISFORUM BD 770i comes equipped with a pre-installed CPU cooler, and there’s space to add an additional 120mm fan to enhance airflow. Plus, an M.2 SSD cooler is included to ensure your storage stays cool and performs at its best.

Connectivity is a breeze with this motherboard. It includes a 2.5Gb Ethernet port for fast internet, multiple USB ports for peripherals, HDMI and DisplayPort for your monitors, and a USB Type-C port that supports an alternate display mode. The motherboard also supports dual-channel SODIMM DDR5 memory, allowing for RAM speeds up to 5200 MT/s, which is essential for quick data processing.

AMD Zen 4 mini ITX PC

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When it comes to storage, you won’t be left wanting. The motherboard features two M.2 2280 PCIe 5.0 SSD slots for lightning-fast data access and comes with a 2TB M.2 SSD pre-installed. There’s also an M.2 2230 key slot for adding Bluetooth and Wi-Fi modules, and with Wi-Fi 6 pre-installed, you can expect speedy wireless connections.

For those who want to push their graphics to the next level, there’s a full-size PCIe 5.0 x16 slot ready for a high-end GPU like the AMD Radeon RX 7800 XT. Combine this with 32GB of DDR5 RAM, and the MINISFORUM BD 770i is transformed into a formidable gaming machine.

The entire system is housed in a Cooler Master QB 500 case, which is versatile and can be tailored to fit your available space. This case supports the impressive hardware configuration and ensures that your components are well-protected and efficiently cooled.

Performance-wise, the MINISFORUM BD 770i is impressive. Through benchmarks and gaming tests, it’s clear that the CPU and GPU can deliver exceptional performance, often on par with much larger systems. And with a price tag of $399, it’s an affordable option for those looking to build a Zen 4 mini-ITX system.

For anyone looking to create a compact build without losing out on power, the MINISFORUM BD 770i is certainly worth considering. It showcases the incredible advancements in mini-ITX motherboards, offering top-tier performance in a small package. If you’re interested in purchasing or want to find out more, product links are available. We also encourage you to join the conversation and share any additional tests or insights on small form factor builds.

Image Source : ETA Prime

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