‘The socket is becoming the motherboard’ — how a Samsung-backed startup wants to change computing forever by integrating everything in an elegant packaging to tackle the AI beast once and for all
Many system designers are exploring chiplet-based SiPs that move beyond the limitations and costs of huge single-die implementations, but which depend heavily on silicon interposers as substrates for mounting and interconnecting the dies. Silicon interposers deliver a higher data rate than organic substrates, but are not without drawbacks. They are costly, proprietary and limit the … Read more