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Samsung confirms next generation HBM4 memory is in fact Snowbolt — and reveals it plans to flood the market with precious AI memory amidst growing competition with SK Hynix and Micron

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Samsung has revealed it expects to triple its HBM chip production this year.

“Following the third-generation HBM2E and fourth-generation HBM3, which are already in mass production, we plan to produce the 12-layer fifth-generation HBM and 32 gigabit-based 128 GB DDR5 products in large quantities in the first half of the year,” SangJoon Hwang, EVP and Head of DRAM Product and Technology Team at Samsung said during a speech at Memcon 2024.

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