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The socket is the motherboard, Part 2 — Intel archrival (and Nvidia’s BFF) plans to build giant chips that could use kilowatts of power but they won’t be as big as Cerebras trillion transistor behemoth

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A few weeks ago, we wrote how Eliyan’s NuLink PHY could do away with silicon interposers and integrate everything into an single, elegant package. How, essentially, the socket could become the motherboard.

At the recent 30th annual North America Technology Symposium, the Taiwan Semiconductor Manufacturing Company (TSMC) revealed plans to construct a version of its chip-on-wafer-on-substrate (CoWoS) packaging technology that could lead to system-in-packages (SiPs) over twice the size of the current largest ones.

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By lisa nichols

Passionate about the power of words and their ability to inform, inspire, and ignite change, lisa Nichols is an accomplished article writer with a flair for crafting engaging and informative content. With a deep curiosity for various subjects and a dedication to thorough research, lisa Nichols brings a unique blend of creativity and accuracy to every piece

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