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Adani Group planea un proyecto de chip de 10 mil millones de dólares en Maharashtra con la empresa israelí Tower Semiconductor

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La empresa israelí Tower Semiconductor y Adani Group invertirán 10.000 millones de dólares (alrededor de 83.958 millones de rupias) en un proyecto de semiconductores en el estado occidental de la India, dijo el jueves el primer ministro de Maharashtra en una publicación en X.

India ha tomado medidas para alentar a las empresas globales a establecer sus unidades de fabricación en el país, como el primer ministro Narendra Modi pretende hacer del país. fabricante de chips al mundo a pesar de los reveses iniciales.

Foxconn En julio del año pasado, Aramex se retiró de una empresa conjunta de semiconductores de 19.500 millones de dólares (alrededor de 1.630 millones de rupias) con Vedanta de la India, y también se detuvieron los planes para ISMC, una empresa conjunta entre Next Orbit Ventures, con sede en Abu Dhabi, y Tower Semiconductor Company. invertir 3.000 millones de dólares (alrededor de 25.000 millones de rupias) en la India.

Sin embargo, India espera que su mercado de semiconductores tenga un valor de 63.000 millones de dólares (alrededor de 528.937 millones de rupias) para 2026.

Semiconductores La fabricación representa la última incursión del multimillonario Gautam Adani, cuya empresa tiene negocios en puertos, instalaciones eléctricas, transporte y comercio de carbón.

La planta de semiconductores de 10.000 millones de dólares (alrededor de 83.958 millones de rupias) en el estado tendrá inicialmente una capacidad de producción de 40.000 obleas, dijo el viceministro principal de Maharashtra, Devendra Fadnavis, en una publicación en X.

El ministro principal del estado, Ehnath Shinde, dijo en una publicación en las redes sociales que el jueves se aprobaron proyectos por valor de 1,17 billones de rupias, que crearán 29.000 oportunidades de empleo en el estado.

dos nuevos coche electrico También se establecerán unidades de fabricación en el estado, y Skoda-Volkswagen invertirá 150 mil millones de rupias en su fábrica para producir vehículos eléctricos e híbridos.

Toyota Kirloskar destinará 212,73 mil millones de rupias a la fabricación de vehículos híbridos y eléctricos en su planta del estado.

Adani Group, Tower Semiconductor, Skoda Volkswagen y Toyota Kirloskar no respondieron de inmediato a una solicitud de comentarios de Reuters.

© Thomson Reuters 2024

(Esta historia no ha sido editada por el personal de NDTV y se genera automáticamente a partir de un feed sindicado).

(Descargo de responsabilidad: New Delhi TV es una subsidiaria de AMG Media Networks Limited, una empresa del Grupo Adani).



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Samsung Semiconductor lideró el primer trimestre de 2024, pero Foundry no estaba cerca de TSMC

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Última actualización: 25 de junio de 2024 a las 13:17 UTC+02:00

Aunque Samsung está lejos de liderar el mercado de fundición, el negocio de semiconductores de la compañía en el primer trimestre de 2024 se encontraba en el mejor lugar imaginable. Los observadores del mercado dicen que Samsung fue la empresa de semiconductores más grande del mundo en el primer trimestre de 2024, por delante de Nvidia, Intel y otras.

Primero, las buenas noticias. de acuerdo a Investigación de contrapuntoSamsung ocupó el primer lugar en el mercado mundial de semiconductores en el primer trimestre de 2024.

Samsung capturó el 11% del mercado de semiconductores y superó a competidores como Nvidia (10%), Intel (9%), SK Hynix (7%), Qualcomm (6%) y otros.

Los observadores del mercado dicen que el éxito de Samsung en el segmento de semiconductores fue posible principalmente gracias a la importante demanda del mercado de memoria para aplicaciones DDR5 y soluciones de almacenamiento para IA generativa.

La empresa todavía está muy por detrás de TSMC en el negocio de la fundición.

En cuanto a las noticias no tan buenas, Samsung no estuvo cerca de TSMC en el mercado de fundición en el primer trimestre de 2024. Los observadores de la industria dicen que el mercado de fundición en el primer trimestre del año experimentó algunos cambios dinámicos notables, y TSMC superó las expectativas del mercado gracias a la inteligencia artificial. – Demandas relacionadas.

TSMC capturó el 62% del mercado de fundición. Los ingresos de Samsung Foundry disminuyeron, pero la compañía mantuvo el segundo lugar con una participación de mercado del 13%.

Su rival más pequeño, SMIC, ocupó por primera vez el tercer lugar en el podio, con una participación de mercado del 6%, mientras que UMC y GlobalFoundries ocuparon el cuarto y quinto lugar con una participación de mercado del 6% y el 5% respectivamente.

Crédito de la imagen: Samsung

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Samsung gets $6.4 billion in incentives for its semiconductor chip plant in USA

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Last month, it was reported that Samsung could get a $6 billion grant from the US government to build advanced chip factories in the US. The US government has now officially announced that it is offering $6.4 billion in grants to Samsung Electronics for its chipmaking investments in Texas.

Samsung will invest $44 billion to make chips in Texas, USA

Samsung Semiconductor Chip

The US government announced earlier today that it plans to offer tax incentives of up to $6.4 billion to Samsung Electronics. The Commerce Department has reached this preliminary agreement with Samsung under the US government’s CHIPS and Science Act. This grant will ease Samsung’s efforts to build two chip plants (Austin and Taylor) in Texas. While the chip plant in Austin is old, the company is building an advanced chip plant in Taylor. Samsung is also said to be making a chip packaging facility and a chip research center.

Local chip production is set to reduce the USA’s reliance on other countries like China, South Korea, and Taiwan. It will also boost local aerospace, automobile, electronics, and defense industries.

White House National Economic Adviser Lael Brainard said, “The return of leading-edge chip manufacturing to America is a major new chapter in our semiconductor industry.” Biden’s administration has already granted similar tax incentives and sops to competing chip firms, including Intel, Global Foundries, Microchip Technology Inc., and TSMC.

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Intel and UMC join forces for 12-nanometer semiconductor

Intel and UMC join forces for 12-nanometer semiconductor process platform
Intel Corp. and United Microelectronics Corporation (UMC) have joined forces in a significant move that is poised to reshape the landscape of the semiconductor industry. They are working together to create a new 12-nanometer semiconductor process platform, a development that is eagerly anticipated by markets that rely heavily on advanced technology, such as mobile devices, communication infrastructure, and networking. This collaboration is a strategic blend of Intel’s manufacturing prowess and UMC’s specialized process knowledge, which is expected to offer customers more advanced options and bolster the supply chain across various regions.

At the heart of this partnership is the development of a 12-nanometer process platform that incorporates FinFET technology. This technology is known for delivering high performance and energy efficiency, which are critical factors in today’s fast-paced and power-conscious market. Intel is set to bring its manufacturing expertise and FinFET design knowledge to the table, while UMC will contribute its process development experience, including providing a Process Design Kit (PDK) and design support services. The goal of this joint venture is to create a process platform that will stand out in the competitive semiconductor market.

12-nanometer semiconductor

The production of this new technology is scheduled to commence in 2027 at Intel’s Ocotillo Technology Fabrication facility located in Arizona. This strategic location will allow the partnership to take advantage of the existing infrastructure, optimizing investment and resource utilization. The collaboration goes beyond just manufacturing; it also encompasses design enablement, focusing on electronic design automation and intellectual property solutions. This ensures that the 12 nm process will be capable of meeting the intricate demands of future semiconductor applications.

“Taiwan has been a critical part of the Asian and global semiconductor and broader technology ecosystem for decades, and Intel is committed to collaborating with innovative companies in Taiwan, such as UMC, to help better serve global customers,” said Stuart Pann, Intel senior vice president and general manager of Intel Foundry Services (IFS). “Intel’s strategic collaboration with UMC further demonstrates our commitment to delivering technology and manufacturing innovation across the global semiconductor supply chain and is another important step toward our goal of becoming the world’s second-largest foundry by 2030.”

Jason Wang, UMC co-president, said, “Our collaboration with Intel on a U.S.-manufactured 12 nm process with FinFET capabilities is a step forward in advancing our strategy of pursuing cost-efficient capacity expansion and technology node advancement in continuing our commitment to customers. This effort will enable our customers to smoothly migrate to this critical new node, and also benefit from the resiliency of an added Western footprint. We are excited for this strategic collaboration with Intel, which broadens our addressable market and significantly accelerates our development roadmap leveraging the complementary strengths of both companies.”

Intel’s involvement in this venture is a critical part of its larger goal to secure its position as the world’s second-largest foundry by the end of this decade. This ambition is supported by substantial investments in manufacturing facilities across the globe. UMC, with its over 40 years of experience as a foundry service provider and a robust presence in Asia, brings to the table its expertise in mature technology nodes and specialty processes. The partnership is a testament to both companies’ commitment to pushing forward their development strategies and expanding their influence in the market.

The alliance between Intel and UMC on the 12-nanometer semiconductor process platform is a strategic move that promises to deliver a potent, efficient, and flexible solution to meet the evolving needs of high-growth markets. With a well-defined production timeline and a comprehensive strategic plan, this collaboration is set to drive innovation and growth for both Intel, UMC, and their customers. The semiconductor industry is on the brink of a new era, and this partnership is at the forefront, ready to deliver the next wave of technological advancements.

Filed Under: Technology News, Top News





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